⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25426864 | 0.98 | — | — | |
| SCHEMBL30307808 | 0.81 | — | — | |
| SCHEMBL8719740 | 0.79 | — | — | |
| SCHEMBL1905434 | 0.79 | — | — | |
| SCHEMBL18006226 | 0.74 | — | — | |
| SCHEMBL179838 | 0.71 | — | — | |
| SCHEMBL26965455 | 0.71 | — | — | |
| SCHEMBL81570 | 0.71 | — | — | |
| SCHEMBL179821 | 0.69 | — | — | |
| SCHEMBL179877 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 168 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118325193-A | High-performance heat-conducting wave-absorbing material with high heat conduction and high voltage resistance, and preparation method and application thereof | 浙江三元电子科技有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-116761851-B | Thermally conductive composition, thermally conductive member, and battery module | 积水保力马科技株式会社 | 2026-05-22 | — | — | CN | disclosed |
| EP-3950845-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2026-04-01 | — | — | EP | disclosed |
| EP-3950844-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2026-03-11 | — | — | EP | disclosed |
| CN-121574568-A | Low-volatility heat conduction gasket and preparation method thereof | 浙江三元电子科技有限公司 | 2026-02-27 | — | — | CN | disclosed |
| US-20260047467-A1 | CONDUCTIVE PILLAR MODULE PRECURSOR FOR MANUFACTURING SEMICONDUCTOR, CONDUCTIVE PILLAR MODULE FOR MANUFACTURING SEMICONDUCTOR, SEMICONDUCTOR OR SEMICONDUCTOR PRECURSOR, AND METHOD FOR MANUFACTURING SAME | DOW TORAY CO LTD (JP) | 2026-02-12 | — | — | US | disclosed |
| US-20260024678-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING ELECTRODE LAYER, MULTILAYER BODY COMPRISING ELECTRODE LAYER, USE OF SAME AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2026-01-22 | — | — | US | disclosed |
| US-20260024679-A1 | ELECTRODE-LAYER-FORMING CURABLE ORGANOPOLYSILOXANE COMPOSITION, LAMINATE EQUIPPED WITH ELECTRODE LAYER, USE THEREOF, AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2026-01-22 | — | — | US | disclosed |
| US-20260022275-A1 | HOT MELT TYPE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING ELECTRODE LAYER, MULTILAYER BODY COMPRISING ELECTRODE LAYER, USE OF SAME AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2026-01-22 | — | — | US | disclosed |
| EP-3950846-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME | DOW TORAY CO LTD (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20110190410-A1 | Multi-Component Sponge-Forming Liquid Silicone Rubber Composition And Silicone Rubber Sponge Manufacturing Method | DOW TORAY CO., LTD. (JP) | 2011-08-04 | — | — | US | disclosed |
| EP-2118202-B1 | SPONGE-FORMING LIQUID SILICONE-RUBBER COMPOSITION AND SILICONE RUBBER SPONGE MADE THEREFROM | DOW CORNING TORAY CO LTD (JP) | 2011-06-22 | — | — | EP | disclosed |
| EP-2311912-A1 | MULTI-COMPONENT SPONGE-FORMING LIQUID SILICONE RUBBER COMPOSITION AND SILICONE RUBBER SPONGE MANUFACTURING METHOD | Dow Corning Toray Co., Ltd. (JP) | 2011-04-20 | — | — | EP | disclosed |
| US-20110074061-A1 | Process For Producing Molded Silicone Rubber Sponge | DOW TORAY CO., LTD. (JP) | 2011-03-31 | — | — | US | disclosed |
| US-20110021649-A1 | Sponge-Forming Liquid Silicone-Rubber Composition and Silicone Rubber Sponge Made Therefrom | DOW CORNING TORAY COMPANY, LTD. (JP) | 2011-01-27 | — | — | US | disclosed |
| US-20100144933-A1 | Addition-Reaction-Curable Silicone Rubber Composition and a Molded Article Therefrom | DOW CORNING TORAY CO., LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| EP-2125955-A1 | ADDITION-REACTION-CURABLE SILICONE RUBBER COMPOSITION AND A MOLDED ARTICLE THEREFROM | Dow Corning Toray Co., Ltd. (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-2118202-A1 | SPONGE-FORMING LIQUID SILICONE-RUBBER COMPOSITION AND SILICONE RUBBER SPONGE MADE THEREFROM | Dow Corning Toray Co., Ltd. (JP) | 2009-11-18 | — | — | EP | disclosed |
| WO-2008096882-A1 | SPONGE-FORMING LIQUID SILICONE-RUBBER COMPOSITION AND SILICONE RUBBER SPONGE MADE THEREFROM | DOW CORNING TORAY CO., LTD. (JP) | 2008-08-14 | — | — | WO | disclosed |
| WO-2008081952-A1 | ADDITION-REACTION-CURABLE SILICONE RUBBER COMPOSITION AND A MOLDED ARTICLE THEREFROM | DOW CORNING TORAY CO., LTD. (JP) | 2008-07-10 | — | — | WO | disclosed |