SCHEMBL971458

SCHEMBL971458

C=CCO[PH](=O)CC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8022662 0.97
SCHEMBL10490404 0.82
SCHEMBL10490394 0.82
SCHEMBL11327520 0.77
SCHEMBL30384 0.77
SCHEMBL9166923 0.76
Ammonia Solution, Strong SCHEMBL29217970 0.74
SCHEMBL28931612 0.74
SCHEMBL3806976 0.74
SCHEMBL6450164 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0245799-A2 Electromagnetic wave-sensitive material and bio-adaptable surface treating agent TERUMO KABUSHIKI KAISHA (JP) 1987-11-19 EP claimed
CN-119546662-A Adhesive composition DDP特种电子材料美国有限责任公司 2025-02-28 CN disclosed
CN-119490747-A Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board 广东生益科技股份有限公司 2025-02-21 CN disclosed
CN-116410595-B Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2025-02-14 CN disclosed
CN-116410596-B Resin composition and application thereof 广东生益科技股份有限公司 2025-02-14 CN disclosed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN disclosed
CN-118240374-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN disclosed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 CN disclosed
CN-112912454-B Reworkable adhesive composition 汉高股份有限及两合公司 2023-09-22 CN disclosed
CN-116525945-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery using same 三菱化学株式会社 2023-08-01 CN disclosed
US-7622522-B2 Flame-retardant poly(arylene ether) composition and its use as a covering for coated wire SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-11-24 US disclosed
US-7592382-B2 Flame retardant poly(arylene ether)/polyamide compositions, methods, and articles SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-09-22 US disclosed
CN-101495293-A Dual cure adhesive formulations LORD CORP (US) 2009-07-29 CN disclosed
CN-101432923-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEM CORP (JP) 2009-05-13 CN disclosed
US-20090088501-A1 FLAME-RETARDANT POLY(ARYLENE ETHER) COMPOSITION AND ITS USE AS A COVERING FOR COATED WIRE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2009-04-02 US disclosed
CN-100463284-C Nonaqueous electrolyte secondary battery MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2009-02-18 CN disclosed
US-20070244231-A1 FLAME RETARDANT POLY(ARYLENE ETHER)/POLYAMIDE COMPOSITIONS, METHODS, AND ARTICLES SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2007-10-18 US disclosed
EP-0245799-B1 ELECTROMAGNETIC WAVE-SENSITIVE MATERIAL AND BIO-ADAPTABLE SURFACE TREATING AGENT TERUMO KABUSHIKI KAISHA (JP) 1991-10-23 EP disclosed
EP-0245799-A2 Electromagnetic wave-sensitive material and bio-adaptable surface treating agent TERUMO KABUSHIKI KAISHA (JP) 1987-11-19 EP disclosed
US-4111900-A BROMINE-CONTAINING PHOSPHINIC ACID ESTERS AND FLAME-RESISTANT PLASTIC MOLDING COMPOSITIONS HOECHST AKTIENGESELLSCHAFT (DE) 1978-09-05 US disclosed