SCHEMBL9718036

SCHEMBL9718036

C=CC(C)(C=C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2163705 0.82
SCHEMBL21170139 0.76 MEN1 (0.31)
SCHEMBL5275167 0.74
SCHEMBL27438695 0.73
SCHEMBL3682666 0.71
SCHEMBL182083 0.71
SCHEMBL17219158 0.69
SCHEMBL16316042 0.67
SCHEMBL123229 0.67
SCHEMBL8365351 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1294163-C Process for producing hyperbranched polymers JOHNSON S C COMM MARKETS INC (US) 2007-01-10 CN disclosed
CN-1265680-A Process for producing hyperbranched polymers JOHNSON S C COMM MARKETS INC (US) 2000-09-06 CN disclosed
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 EP disclosed