SCHEMBL9718177

SCHEMBL9718177

C=C(C)C(C)=CCC(C)C

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
GRIK1 P39086 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9718175 1.00 TSHR (0.33) TSHRGRIK1
SCHEMBL11833356 0.80
SCHEMBL11833363 0.80
Methacrylic Acid SCHEMBL5144111 0.80 GRIK1 (0.42) TSHRGRIK1
SCHEMBL19262241 0.78
SCHEMBL14480067 0.77
SCHEMBL14480064 0.77
SCHEMBL14480063 0.77
SCHEMBL14480066 0.77
SCHEMBL6656799 0.74 GRIK1 (0.39) TSHRGRIK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 EP disclosed