SCHEMBL974976

SCHEMBL974976

[CH2][CH][CH]C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL974082 0.75
Propene SCHEMBL1737 0.72
Propene SCHEMBL1955623 0.67
Butadiene SCHEMBL645108 0.63
SCHEMBL43209 0.63
SCHEMBL1631 0.62
SCHEMBL20545 0.62
SCHEMBL61116 0.62
SCHEMBL1632 0.62
Propene SCHEMBL8064619 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240201593-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
CN-117999296-A Composition and photosensitive composition 东京应化工业株式会社 2024-05-07 CN disclosed
CN-117980346-A Composition and photosensitive composition 东京应化工业株式会社 2024-05-03 CN disclosed
CN-117980347-A Photosensitive composition 东京应化工业株式会社 2024-05-03 CN disclosed
WO-2024063044-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-03-28 WO disclosed
US-11932600-B2 Biaryl derivative DAIICHI SANKYO COMPANY LIMITED (JP) 2024-03-19 US disclosed
US-20240069441-A1 COMPOSITION FOR RESIST UNDERLYING FILM FORMATION NISSAN CHEMICAL CORPORATION (JP) 2024-02-29 US disclosed
CN-117031874-A Negative photosensitive resin composition, cured product, and method for producing patterned cured product 东京应化工业株式会社 2023-11-10 CN disclosed
WO-2023157943-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE 日産化学株式会社 2023-08-24 WO disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
US-6335143-B1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2002-01-01 US disclosed
EP-1054031-A2 Increasing the molecular weight and modification of condensation polymers Ciba SC Holding AG (CH) 2000-11-22 EP disclosed
EP-0934925-A1 Process for the preparation of beta-alkoxy nitriles BASF AKTIENGESELLSCHAFT (DE) 1999-08-11 EP disclosed
EP-0887706-A1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 1998-12-30 EP disclosed
US-5807932-A USING A HYDROXYPHENYLALKYLPHOSPHORIC ESTER CIBA SPECIALTY CHEMICALS CORPORATION (US) 1998-09-15 US disclosed
EP-0785967-A1 INCREASING THE MOLECULAR WEIGHT OF POLYCONDENSATES Ciba SC Holding AG (CH) 1997-07-30 EP disclosed
WO-1996011978-A1 INCREASING THE MOLECULAR WEIGHT OF POLYCONDENSATES CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 1996-04-25 WO disclosed
EP-0571416-A1 (CARBOXYL)ALKYLOXYALKYL DERIVATIVES OF CYCLODEXTRINS JANSSEN PHARMACEUTICA N.V. (BE) 1993-12-01 EP disclosed
WO-1992014762-A1 (CARBOXYL)ALKYLOXYALKYL DERIVATIVES OF CYCLODEXTRINS JANSSEN PHARMACEUTICA N.V. (BE) 1992-09-03 WO disclosed
EP-0499322-A1 (Carboxyl)alkyloxyalkyl derivatives of cyclodextrins JANSSEN PHARMACEUTICA N.V. (BE) 1992-08-19 EP disclosed