⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29355039 | 0.71 | — | — | |
| SCHEMBL29375564 | 0.71 | — | — | |
| SCHEMBL8860314 | 0.71 | — | — | |
| SCHEMBL4559297 | 0.71 | — | — | |
| SCHEMBL23794408 | 0.50 | — | — | |
| SCHEMBL21951309 | 0.50 | — | — | |
| SCHEMBL20718905 | 0.50 | — | — | |
| SCHEMBL21496128 | 0.50 | — | — | |
| SCHEMBL21951452 | 0.50 | — | — | |
| SCHEMBL20718912 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 532 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260068667-A1 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2026-03-05 | — | — | US | claimed |
| US-20250357264-A1 | HEAT DISSIPATION BY NANO PIPES | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-11-20 | — | — | US | claimed |
| US-20250140697-A1 | INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-05-01 | — | — | US | claimed |
| US-20250140644-A1 | HEAT DISSIPATION BY NANO PIPES | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-05-01 | — | — | US | claimed |
| CN-119905457-A | Contact structure and forming method thereof | 台湾积体电路制造股份有限公司 | 2025-04-29 | — | — | CN | claimed |
| CN-119517902-A | Integrated chip structure and forming method thereof | 台湾积体电路制造股份有限公司 | 2025-02-25 | — | — | CN | claimed |
| CN-118157612-A | Single crystal film bulk acoustic resonator and electric product | 天津大学 | 2024-06-07 | — | — | CN | claimed |
| US-20240043732-A1 | HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR | KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY (KR) | 2024-02-08 | — | — | US | claimed |
| EP-4269486-A1 | HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR | Korea Institute of Ceramic Engineering and Technology (KR) | 2023-11-01 | — | — | EP | claimed |
| WO-2023120923-A1 | HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR | 한국세라믹기술원 | 2023-06-29 | — | — | WO | claimed |
| WO-2008089439-A2 | METHODS AND COMPOSITIONS FOR ENHANCING LIFESPAN INVOLVING SIRTUIN-MODULATING COMPOUNDS AND CHALCOGENIDES | FRED HUTCHINSON CANCER RESEARCH CENTER (US) | 2008-07-24 | — | — | WO | claimed |
| US-20080171726-A1 | oxygen antagonists; reducing agent, preservatives; enhancing survivability and achieving stasis or pre-stasis in biological materials (cells, tissues); organ transplantation, hyperthermia, wound healing, hemorrhagic shock, cardioplegia for bypass surgery, neurodegeneration, hypothermia, and cancer | ROTH MARK B | 2008-07-17 | — | — | US | claimed |
| EP-1831756-A4 | REFLECTION PLATE FOR BACKLIGHT UNIT AND BACKLIGHT UNIT OF LIQUID CRYSTAL DISPLAY HAVING GOOD THERMAL CONDUCTIVITY | LG CHEMICAL LTD (KR) | 2008-03-05 | — | — | EP | claimed |
| EP-1831756-A1 | REFLECTION PLATE FOR BACKLIGHT UNIT AND BACKLIGHT UNIT OF LIQUID CRYSTAL DISPLAY HAVING GOOD THERMAL CONDUCTIVITY | LG Chem, Ltd. (KR) | 2007-09-12 | — | — | EP | claimed |
| US-20070078113-A1 | Oxygen antagonists; reducing agent, preservatives; enhancing survivability and achieving stasis or pre-stasis in cells or tissues; organ transplantation, hyperthermia, wound healing, hemorrhagic shock, cardioplegia for bypass surgery, neurodegeneration, hypothermia, and cancer | FRED HUTCHINSON CANCER RESEARCH CENTER | 2007-04-05 | — | — | US | claimed |
| WO-2007027026-A1 | REFLECTION PLATE FOR BACKLIGHT UNIT AND BACKLIGHT UNIT OF LIQUID CRYSTAL DISPLAY HAVING GOOD THERMAL CONDUCTIVITY | LG CHEM, LTD. (KR) | 2007-03-08 | — | — | WO | claimed |
| US-20070047253-A1 | Reflection plate for backlight unit and backlight unit of liquid crystal display having good thermal conductivity | LG CHEM, LTD. (KR) | 2007-03-01 | — | — | US | claimed |
| US-20050176869-A1 | HEAT ABSORB-RELEASE PLASTIC RESIN COMPOSITION AND MOLDED PRODUCT THEREOF | LG CHEM, LTD. (KR) | 2005-08-11 | — | — | US | claimed |
| US-6927249-B1 | Heat absorb-release plastic resin composition and molded product thereof | LG CHEM, LTD. (KR) | 2005-08-09 | — | — | US | claimed |
| US-5232970-A | High strength, heat and moisture resistance, flexibility, dielectric for encapsulation of circuits | THE DOW CHEMICAL COMPANY (US) | 1993-08-03 | — | — | US | claimed |