⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4665491 | 0.75 | — | — | |
| SCHEMBL7695669 | 0.71 | — | — | |
| SCHEMBL11820206 | 0.71 | — | — | |
| SCHEMBL2892536 | 0.71 | — | — | |
| SCHEMBL6862167 | 0.71 | — | — | |
| SCHEMBL7691346 | 0.66 | — | — | |
| SCHEMBL827400 | 0.66 | — | — | |
| SCHEMBL4664149 | 0.66 | — | — | |
| SCHEMBL15602752 | 0.66 | — | — | |
| SCHEMBL23908703 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| EP-3352281-B1 | NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY | ADEKA CORP (JP) | 2021-08-11 | — | — | EP | disclosed |
| CN-108140887-B | Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery | 株式会社艾迪科 | 2021-03-12 | — | — | CN | disclosed |
| US-10734684-B2 | Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery | ADEKA CORPORATION (JP) | 2020-08-04 | — | — | US | disclosed |
| US-20180226683-A1 | NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROPLYTE SECONDARY BATTERY | ADKEA CORPORATION (JP) | 2018-08-09 | — | — | US | disclosed |
| EP-3352281-A1 | NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY | Adeka Corporation (JP) | 2018-07-25 | — | — | EP | disclosed |
| US-8475937-B2 | Silicone composition and organic light-emitting diode | DOW CORNING CORPORATION (US) | 2013-07-02 | — | — | US | disclosed |
| EP-2262861-B1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | DOW CORNING (US) | 2012-09-19 | — | — | EP | disclosed |
| US-20110017986-A1 | Silicone Composition and Organic Light-Emitting Diode | DOW CORNING CORPORATION | 2011-01-27 | — | — | US | disclosed |
| EP-2262861-A1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | Dow Corning Corporation (US) | 2010-12-22 | — | — | EP | disclosed |
| WO-2009120434-A1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | DOW CORNING CORPORATION (US) | 2009-10-01 | — | — | WO | disclosed |