⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28235540 | 1.00 | — | — | |
| SCHEMBL11298856 | 0.93 | — | — | |
| SCHEMBL3822761 | 0.93 | — | — | |
| SCHEMBL3239368 | 0.93 | — | — | |
| SCHEMBL27884822 | 0.93 | — | — | |
| SCHEMBL11422890 | 0.93 | — | — | |
| SCHEMBL33435 | 0.91 | — | — | |
| SCHEMBL3393 | 0.91 | — | — | |
| SCHEMBL21295297 | 0.91 | — | — | |
| SCHEMBL2678975 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0431938-A1 | Dielectric compositions of devitrified glass | GENERAL ELECTRIC COMPANY (US) | 1991-06-12 | — | — | EP | claimed |
| US-4997795-A | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | GENERAL ELECTRIC COMPANY (US) | 1991-03-05 | — | — | US | claimed |
| US-4830988-A | MAGNESIUM-BARIUM-ALUMINUM-ZIRCONIUM-BOROPHOSPHOSILICATE GLASS | GENERAL ELECTRIC COMPANY (US) | 1989-05-16 | — | — | US | claimed |
| US-4808673-A | ZINC-MAGNESIUM-BARIUM-ALUMINUM-ZIRCONIUM-PHOSPHOSILICATE GLASS FRIT | GENERAL ELECTRIC COMPANY (US) | 1989-02-28 | — | — | US | claimed |
| US-4772574-A | INKS; INTEGRATED CIRCUITS; FRITS; OXIDES OF LEAD, ZINC, ALUMINUM, BORON, SILICON | GENERAL ELECTRIC COMPANY (US) | 1988-09-20 | — | — | US | claimed |
| EP-0262974-A2 | Dielectric inks and frits for multilayer circuits | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | claimed |
| EP-0431938-A1 | Dielectric compositions of devitrified glass | GENERAL ELECTRIC COMPANY (US) | 1991-06-12 | — | — | EP | disclosed |
| US-4997795-A | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | GENERAL ELECTRIC COMPANY (US) | 1991-03-05 | — | — | US | disclosed |
| US-4880567-A | MULTILAYER CIRCUITS, GLASS FRITS | GENERAL ELECTRIC COMPANY (US) | 1989-11-14 | — | — | US | disclosed |
| US-4874550-A | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-10-17 | — | — | US | disclosed |
| US-4863517-A | Via fill ink composition for integrated circuits | GENERAL ELECTRIC COMPANY (US) | 1989-09-05 | — | — | US | disclosed |
| US-4830988-A | MAGNESIUM-BARIUM-ALUMINUM-ZIRCONIUM-BOROPHOSPHOSILICATE GLASS | GENERAL ELECTRIC COMPANY (US) | 1989-05-16 | — | — | US | disclosed |
| US-4816615-A | MIXTURE OF COPPER POWDER, GLASS FRIT AND ADHESION PROMOTER | GENERAL ELECTRIC COMPANY (US) | 1989-03-28 | — | — | US | disclosed |
| US-4808673-A | ZINC-MAGNESIUM-BARIUM-ALUMINUM-ZIRCONIUM-PHOSPHOSILICATE GLASS FRIT | GENERAL ELECTRIC COMPANY (US) | 1989-02-28 | — | — | US | disclosed |
| EP-0304309-A1 | Thick film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | disclosed |
| EP-0304310-A1 | Devitrifying glass frits | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | disclosed |
| US-4788163-A | SUBSTRATES FOR DIRECT MOUNTING OF SILICON CHIPS; DIELECTRICS; THICK FILM VIA-FILL INKS | GENERAL ELECTRIC COMPANY (US) | 1988-11-29 | — | — | US | disclosed |
| US-4772574-A | INKS; INTEGRATED CIRCUITS; FRITS; OXIDES OF LEAD, ZINC, ALUMINUM, BORON, SILICON | GENERAL ELECTRIC COMPANY (US) | 1988-09-20 | — | — | US | disclosed |
| EP-0262974-A2 | Dielectric inks and frits for multilayer circuits | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |
| EP-0262975-A2 | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |