⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19075845 | 0.68 | — | — | |
| SCHEMBL7623581 | 0.67 | — | — | |
| SCHEMBL9649209 | 0.65 | — | — | |
| SCHEMBL9814459 | 0.64 | — | — | |
| SCHEMBL3809546 | 0.64 | — | — | |
| SCHEMBL18579732 | 0.64 | — | — | |
| SCHEMBL447698 | 0.61 | — | — | |
| SCHEMBL18032691 | 0.61 | GSK3A (0.30) | — | |
| SCHEMBL9404686 | 0.59 | — | — | |
| SCHEMBL2230333 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115951559-A | Photosensitive resin composition, preparation method thereof, cured film and application thereof | 福建泓光半导体材料有限公司 | 2023-04-11 | — | — | CN | claimed |
| CN-115850907-A | Phenolic resin composition, preparation method and application thereof, and preparation method of solidified relief pattern | 福建泓光半导体材料有限公司 | 2023-03-28 | — | — | CN | claimed |
| EP-0184553-B1 | MODIFIED PHENOLIC RESINS AND THEIR FABRICATION | CIBA-GEIGY AG (CH) | 1991-07-31 | — | — | EP | claimed |
| EP-0226741-B1 | PROCESS FOR PRODUCING A POSITIVE PHOTORESIST | HOECHST CELANESE CORPORATION (US) | 1989-08-02 | — | — | EP | claimed |
| CN-115951559-A | Photosensitive resin composition, preparation method thereof, cured film and application thereof | 福建泓光半导体材料有限公司 | 2023-04-11 | — | — | CN | disclosed |
| CN-115850907-A | Phenolic resin composition, preparation method and application thereof, and preparation method of solidified relief pattern | 福建泓光半导体材料有限公司 | 2023-03-28 | — | — | CN | disclosed |
| US-4103045-A | PRETREATMENT WITH A POLYSILAZANE | RHONE-POULENC, S.A. (FR) | 1978-07-25 | — | — | US | disclosed |