SCHEMBL9815760

SCHEMBL9815760

OC1CCCC(C2CCCC(O)C2)C1

nearest known ligand 0.47

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.47
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.33
CYP2C9 P11712 1/20 0.33
DPP4 P27487 1/20 0.32
DPP7 Q9UHL4 1/20 0.32
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23916930 1.00 TSHR (0.47) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL18857214 0.97 TSHR (0.53) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL1245216 0.94 TSHR (0.50) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL1244541 0.94 TSHR (0.50) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL1243107 0.94 TSHR (0.50) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL1245214 0.94 TSHR (0.50) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL1244540 0.94 TSHR (0.50) TSHRALDH1A1LMNACYP2C9DPP4
SCHEMBL787466 0.91 TSHR (0.47) TSHRALDH1A1HSD17B10
SCHEMBL22417709 0.91 TSHR (0.40) TSHRALDH1A1LMNACYP2C9
SCHEMBL6083299 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939424-B2 Composition for liquid crystal polymer synthesis, liquid crystal polymer for electrical/electronic products, polymer resin composition, and molded product using the same SK CHEMICALS CO., LTD. (KR) 2024-03-26 US disclosed
EP-3339352-B1 RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-09-16 EP disclosed
EP-3636727-A1 COMPOSITION FOR SYNTHESIZING LIQUID CRYSTAL POLYMER, LIQUID CRYSTAL POLYMER FOR ELECTRIC AND ELECTRONIC PRODUCTS USING SAME, POLYMER RESIN COMPOSITION USING SAME, AND MOLDED PRODUCT USING SAME SK Chemicals Co., Ltd. (KR) 2020-04-15 EP disclosed
US-20200102420-A1 COMPOSITION FOR LIQUID CRYSTAL POLYMER SYNTHESIS, LIQUID CRYSTAL POLYMER FOR ELECTRICAL/ELECTRONIC PRODUCTS, POLYMER RESIN COMPOSITION, AND MOLDED PRODUCT USING THE SAME SK CHEMICALS CO., LTD. (KR) 2020-04-02 US disclosed
EP-3339023-B1 LAMINATE, METHOD FOR MANUFACTURING THE LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2019-07-03 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed
EP-3339023-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE FUJI-FILM Corporation (JP) 2018-06-27 EP disclosed
EP-1837902-B1 Use of organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW GLOBAL TECHNOLOGIES LLC (US) 2017-05-24 EP disclosed
EP-3162868-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2017-05-03 EP disclosed
WO-2010042939-A1 PREPARATION OF ALICYCLIC DIEPOXIDES PROMERUS LLC (US) 2010-04-15 WO disclosed
EP-0197458-B1 CURABLE EPOXY RESIN COMPOSITION ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1991-11-06 EP disclosed
US-4689390-A AMINE-EPOXY ADDUCT REACTED WITH PHENOLIC RESIN, ONE-PACK ASAHI DENKA KOGYO K.K. (JP) 1987-08-25 US disclosed
US-4657947-A COVERING RUSTY METAL SURFACES ASAHI DENKA KOGYO K.K. (JP) 1987-04-14 US disclosed
US-4657953-A CORROSION RESISTANCE ASAHI DENKA KOGYO K.K. (JP) 1987-04-14 US disclosed
EP-0197458-A2 Curable epoxy resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1986-10-15 EP disclosed
US-4535103-A POLYEPOXIDES AND EPOXY RESINS CROSSLINKED AND HARDENED WITH PHOSPHOROUS COMPOUNDS, AMINES, AND DIISOCYANATES ASAHI DENKA KOGYO K.K. (JP) 1985-08-13 US disclosed
US-4530947-A A RUSTY METAL-ADHERING CURABLE MIXTURE OF EPOXIDE-POLYHYDROXIDE REACTION PRODUCT, POLYISOCYANATE AND BITUMINOUS MATERIAL ASAHI DENKA KOGYO K.K. (JP) 1985-07-23 US disclosed
US-4340716-A EPOXY RESINS AND HARDENERS ASAHI DENKA KOGYO K.K. (JP) 1982-07-20 US disclosed
US-3950451-A COUPLED PRODUCT OF ALKYLPHENOL AND PHENOL-FORMALDEHYDE-DIAMINE CONDENSATE ASAHI DENKA KOGYO K.K. (JA) 1976-04-13 US disclosed