⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29178052 | 1.00 | — | — | |
| SCHEMBL5695504 | 0.80 | PIK3CA (0.34) | — | |
| SCHEMBL9456502 | 0.80 | PIK3CA (0.34) | — | |
| SCHEMBL24162042 | 0.74 | DPP4 (0.36) | — | |
| SCHEMBL3924487 | 0.74 | ACE (0.41) | — | |
| SCHEMBL28261258 | 0.74 | ACE (0.41) | — | |
| SCHEMBL23077176 | 0.70 | BCHE (0.35) | — | |
| SCHEMBL23276998 | 0.67 | CYP2C19 (0.33) | — | |
| SCHEMBL9853739 | 0.67 | CYP2C19 (0.33) | — | |
| SCHEMBL4434369 | 0.62 | ACE (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114585704-B | Conductive adhesive, adhesive structure using same, and electronic component | 日本化学工业株式会社 | 2024-01-30 | — | — | CN | disclosed |
| WO-2021140926-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE, AND JOINED STRUCTURE AND ELECTRONIC COMPONENT USING SAME | 日本化学工業株式会社 | 2021-07-15 | — | — | WO | disclosed |
| WO-2021079852-A1 | CONDUCTIVE ADHESIVE, AND ADHESIVE STRUCTURE AND ELECTRONIC COMPONENT USING SAME | 日本化学工業株式会社 | 2021-04-29 | — | — | WO | disclosed |
| EP-0419654-A1 | WATER-SOLUBLE CATIONIC POLYMER | KOHJIN CO. Ltd. (JP) | 1991-04-03 | — | — | EP | disclosed |