SCHEMBL9904398

SCHEMBL9904398

C=C[Si](C)(C)O[Si](C)(O[SiH2]C=C(C)C)O[Si](C)(C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1526923 0.79
SCHEMBL5251273 0.73
SCHEMBL5701488 0.71
SCHEMBL1493075 0.71
SCHEMBL5377092 0.69
SCHEMBL19469317 0.68
SCHEMBL5701385 0.68
SCHEMBL5701497 0.67
SCHEMBL3673806 0.67
SCHEMBL17740594 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2649131-A1 SILOXANE COMPOSITIONS INCLUDING TITANIUM DIOXIDE NANOPARTICLES SUITABLE FOR FORMING ENCAPSULANTS Dow Corning Corporation (US) 2013-10-16 EP disclosed
EP-2649113-A1 SILOXANE COMPOSITIONS INCLUDING METAL-OXIDE NANOPARTICLES SUITABLE FOR FORMING ENCAPSULANTS Dow Corning Corporation (US) 2013-10-16 EP disclosed
EP-2649114-A1 SILOXANE COMPOSITIONS SUITABLE FOR FORMING ENCAPSULANTS Dow Corning Corporation (US) 2013-10-16 EP disclosed
US-20130256741-A1 Siloxane Compositions Suitable For Forming Encapsulants DOW CORNING CORPORATION 2013-10-03 US disclosed
US-20130256742-A1 Siloxane-Compositions Including Metal-Oxide Nanoparticles Suitable For Forming Encapsulants DOW CORNING CORPORATION (US) 2013-10-03 US disclosed
WO-2012078582-A1 SILOXANE COMPOSITIONS INCLUDING METAL-OXIDE NANOPARTICLES SUITABLE FOR FORMING ENCAPSULANTS DOW CORNING CORPORATION (US) 2012-06-14 WO disclosed
WO-2012078617-A1 SILOXANE COMPOSITIONS INCLUDING TITANIUM DIOXIDE NANOPARTICLES SUITABLE FOR FORMING ENCAPSULANTS DOW CORNING CORPORATION (US) 2012-06-14 WO disclosed
WO-2012078594-A1 SILOXANE COMPOSITIONS SUITABLE FOR FORMING ENCAPSULANTS DOW CORNING CORPORATION (US) 2012-06-14 WO disclosed