SCHEMBL9907066

SCHEMBL9907066

C/C=C/C1CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15301606 1.00
SCHEMBL16488541 0.85
SCHEMBL75076 0.81
SCHEMBL8018624 0.77
SCHEMBL8018621 0.77
SCHEMBL5444598 0.76
SCHEMBL3910581 0.75
SCHEMBL14160664 0.74
SCHEMBL8022499 0.74 TBXA2R (0.32)
SCHEMBL8022496 0.74 TBXA2R (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9381506-B2 Cobalt catalysts and their use for hydrosilylation and dehydrogenative silylation MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2016-07-05 US disclosed
US-20150141648-A1 COBALT CATALYSTS AND THEIR USE FOR HYDROSILYLATION AND DEHYDROGENATIVE SILYLATION PRINCETON UNIVERSITY 2015-05-21 US disclosed
US-8934165-B2 Electrophoretic particle, manufacturing method of electrophoretic particle, electrophoretic dispersed liquid, electrophoretic sheet, electrophoretic apparatus, and electronic equipment SEIKO EPSON CORPORATION (JP) 2015-01-13 US disclosed
US-20130265632-A1 ELECTROPHORETIC PARTICLE, MANUFACTURING METHOD OF ELECTROPHORETIC PARTICLE, ELECTROPHORETIC DISPERSED LIQUID, ELECTROPHORETIC SHEET, ELECTROPHORETIC APPARATUS, AND ELECTRONIC EQUIPMENT SEIKO EPSON CORPORATION (JP) 2013-10-10 US disclosed
US-8198380-B2 Composition for thermosetting silicone resin NITTO DENKO CORPORATION (JP) 2012-06-12 US disclosed
US-20100225010-A1 COMPOSITION FOR THERMOSETTING SILICONE RESIN NITTO DENKO CORPORATION (JP) 2010-09-09 US disclosed
EP-2226361-A1 Composition for thermosetting silicone resin NITTO DENKO CORPORATION (JP) 2010-09-08 EP disclosed