⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9912687 | 0.92 | — | — | |
| SCHEMBL6440519 | 0.85 | — | — | |
| SCHEMBL711326 | 0.77 | MAPT (0.36) | — | |
| SCHEMBL31468234 | 0.77 | MAPT (0.36) | — | |
| SCHEMBL14773261 | 0.71 | — | — | |
| SCHEMBL12180888 | 0.71 | — | — | |
| SCHEMBL12180848 | 0.71 | — | — | |
| SCHEMBL23252787 | 0.70 | — | — | |
| SCHEMBL12213058 | 0.69 | — | — | |
| SCHEMBL6852177 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-20210309866-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| EP-3812805-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-04-28 | — | — | EP | disclosed |
| CN-112334795-A | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2021-02-05 | — | — | CN | disclosed |
| CN-106575080-B | Energy-sensitive resin composition | 东京应化工业株式会社 | 2020-08-11 | — | — | CN | disclosed |
| US-10696845-B2 | Energy-sensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| US-10570269-B2 | Composition containing microparticles | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-02-25 | — | — | US | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| CN-105579907-B | Radiation-sensitive composition and pattern production method | 东京应化工业株式会社 | 2019-12-17 | — | — | CN | disclosed |
| US-20190225804-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| US-9981914-B2 | — | — | 2018-05-29 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-9890250-B2 | Method for producing polybenzoxazole resin | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-02-13 | — | — | US | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| CN-107429059-A | ENERGY-SENSITIVE RESIN COMPOSITION | 东京应化工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| EP-2947112-B1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO LTD (JP) | 2017-09-13 | — | — | EP | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| US-20150337084-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-26 | — | — | US | disclosed |
| EP-2947112-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-25 | — | — | EP | disclosed |
| US-20120142193-A1 | RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |