SCHEMBL991544

SCHEMBL991544

C[Al].[HH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL968847 1.00
SCHEMBL29370066 0.87
Hydrochloric Acid SCHEMBL972574 0.75
Bromide SCHEMBL42157 0.75
Bromide SCHEMBL150527 0.75
Iodide SCHEMBL7850409 0.75
Fluoride SCHEMBL6535706 0.75
Iodide SCHEMBL2428472 0.75
Fluoride SCHEMBL150865 0.75
Hydrochloric Acid SCHEMBL149699 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 226 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116099497-A Composite lithium adsorbent and preparation method thereof 中国科学院过程工程研究所 2023-05-12 CN claimed
US-7737024-B2 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. (US) 2010-06-15 US claimed
US-7560816-B2 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. (US) 2009-07-14 US claimed
US-20070296084-A1 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. 2007-12-27 US claimed
US-7217661-B2 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. (US) 2007-05-15 US claimed
US-20060194434-A1 SMALL GRAIN SIZE, CONFORMAL ALUMINUM INTERCONNECTS AND METHOD FOR THEIR FORMATION MICRON TECHNOLOGY, INC. 2006-08-31 US claimed
US-20060014386-A1 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. 2006-01-19 US claimed
US-6946393-B2 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. (US) 2005-09-20 US claimed
US-20050006774-A1 Small grain size, conformal aluminum interconnects and method for their formation MICRON TECHNOLOGY, INC. 2005-01-13 US claimed
US-6355548-B1 Method for manufacturing a gate structure incorporated therein a high K dielectric HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) 2002-03-12 US claimed
US-5180687-A Electroconductive CANON KABUSHIKI KAISHA (JP) 1993-01-19 US claimed
US-5179042-A Vapor deposition CANON KABUSHIKI KAISHA (JP) 1993-01-12 US claimed
US-5154949-A Additive-containing; good surface morphology; transistors; semiconductors CANON KABUSHIKI KAISHA (JP) 1992-10-13 US claimed
EP-0493002-A1 Process for forming deposition film Tsubouchi, Kazuo (JP) 1992-07-01 EP claimed
EP-0466320-A2 Process for preparing a semiconductor device including the selective deposition of a metal CANON KABUSHIKI KAISHA (JP) 1992-01-15 EP claimed
EP-0425084-A1 Process for forming deposited film by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-05-02 EP claimed
EP-0420597-A2 Process for forming a deposited film by use of alkyl aluminum hydride and process for preparing semiconductor device CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0420595-A2 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0420594-A2 Process for forming metal deposited film containing aluminium as main component by use of alkyl aluminium hydride CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0417997-A1 Process for forming metal deposited film containing aluminum as main component by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-03-20 EP claimed