SCHEMBL991546

SCHEMBL991546

[N-]=[N+]=C1C=CC=C(O)C1[N+](=O)[O-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6305412 0.79
SCHEMBL7750541 0.72
SCHEMBL3145441 0.70
SCHEMBL29749227 0.70
SCHEMBL28698765 0.69
Potassium Ion SCHEMBL8096270 0.68
SCHEMBL28067565 0.66
Hydrochloric Acid SCHEMBL28299293 0.64
SCHEMBL11310110 0.62
SCHEMBL27515686 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200094301-A1 Heat-Enhanced Treatment Of Energetic Compounds In Contaminated Soil, Sediment And/Or Water CDM SMITH INC. 2020-03-26 US claimed
US-7795579-B2 Information obtaining method CANON KABUSHIKI KAISHA (JP) 2010-09-14 US claimed
US-20080290268-A1 INFORMATION OBTAINING METHOD CANON KABUSHIKI KAISHA (JP) 2008-11-27 US claimed
CN-1069889-C Lead-free priming mixture for percussion primer OLIN CORP (US) 2001-08-22 CN claimed
CN-1136802-A Lead-free ignition agent for use in percussion detonators OLIN CORP (US) 1996-11-27 CN claimed
JP-4016582-A None JP disclosed
CN-115210317-B Resin sheet and circuit board material using the same MCPP创新有限公司 2024-10-18 CN disclosed
EP-4378682-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL Mitsubishi Chemical Corporation (JP) 2024-06-05 EP disclosed
US-20240166858-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2024-05-23 US disclosed
CN-117642465-A Resin composition, resin sheet, laminate, sheet cured product, and circuit board material 三菱化学株式会社 2024-03-01 CN disclosed
WO-2023008524-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL 三菱ケミカル株式会社 2023-02-02 WO disclosed
US-20230007767-A1 Resin Sheet and Circuit Board Material Using the Same MCPP INNOVATION LLC (JP) 2023-01-05 US disclosed
EP-0828698-A2 IMPROVED NON-TOXIC PRIMER FEDERAL-HOFFMAN, INC., D.B.A. FEDERAL CARTRIDGE CO. (US) 1998-03-18 EP disclosed
WO-1996038397-A2 IMPROVED NON-TOXIC PRIMER FEDERAL-HOFFMAN, INC., DOING BUSINESS AS FEDERAL CARTRIDGE CO. (US) 1996-12-05 WO disclosed
CN-1136802-A Lead-free ignition agent for use in percussion detonators OLIN CORP (US) 1996-11-27 CN disclosed
US-5547528-A Non-toxic primer FEDERAL-HOFFMAN, INC. (US) 1996-08-20 US disclosed
EP-0314898-B2 Igniter for electric ignition systems NIPPON KOKI KK (JP) 1995-07-05 EP disclosed
US-5254838-A Igniter for electric ignition systems NIPPON KOKI CO., LTD. (JP) 1993-10-19 US disclosed
JP-H0416582-A ELECTRONIC TIME DELAY DETONATOR NIPPON OIL & FATS CO LTD 1992-01-21 JP disclosed
EP-0314898-A1 Igniter for electric ignition systems NIPPON KOKI CO., LTD. (JP) 1989-05-10 EP disclosed