SCHEMBL992698

SCHEMBL992698

CCC(N)C1CCNC1.CO[SiH2]OC

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 4/20 0.32
SLC6A4 P31645 4/20 0.32
SLC6A3 Q01959 4/20 0.32
KCNH2 Q12809 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2266330 0.88
SCHEMBL4500790 0.88
SCHEMBL19251155 0.88
SCHEMBL9210144 0.88
SCHEMBL13738433 0.88
Iodide SCHEMBL9406526 0.86 KCNH2 (0.36) SLC6A2SLC6A4SLC6A3KCNH2
SCHEMBL28965939 0.85 KCNH2 (0.30) KCNH2
SCHEMBL38031 0.81 SLC6A2 (0.34) SLC6A2SLC6A4SLC6A3
SCHEMBL28282223 0.79 SLC6A2 (0.36) SLC6A2SLC6A4SLC6A3
SCHEMBL26931555 0.78 SLC6A2 (0.30) SLC6A2SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110199367-B Electrolytic solution for electrolytic capacitor, and method for manufacturing electrolytic capacitor 日本贵弥功株式会社 2021-11-26 CN disclosed
US-10465060-B2 Polyamide composition and molded article produced from the composition UBE INDUSTRIES, LTD. (JP) 2019-11-05 US disclosed
US-10059842-B2 Polyamide resin composition and molded article comprising same UBE INDUSTRIES, LTD. (JP) 2018-08-28 US disclosed
US-20170306126-A1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE COMPOSITION UBE INDUSTRIES, LTD. (JP) 2017-10-26 US disclosed
US-20170137622-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME UBE INDUSTRIES, LTD. (JP) 2017-05-18 US disclosed
EP-3162855-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME UBE Industries, Ltd. (JP) 2017-05-03 EP disclosed
US-20110015324-A1 POLYAMIDE RESIN COMPOSITION FOR A FILM UBE INDUSTRIES, LTD. (JP) 2011-01-20 US disclosed
EP-2270098-A1 POLYAMIDE RESIN COMPOSITION FOR FILM Ube Industries, Ltd. (JP) 2011-01-05 EP disclosed