⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28137145 | 0.79 | — | — | |
| SCHEMBL10775853 | 0.78 | — | — | |
| SCHEMBL9813137 | 0.74 | — | — | |
| SCHEMBL7592318 | 0.73 | — | — | |
| SCHEMBL290193 | 0.73 | — | — | |
| SCHEMBL28006104 | 0.72 | TSHR (0.32) | — | |
| SCHEMBL5350948 | 0.71 | — | — | |
| Hydrochloric Acid SCHEMBL2243177 | 0.71 | TDP1 (0.35) | — | |
| SCHEMBL14507109 | 0.71 | — | — | |
| SCHEMBL7624537 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024095926-A1 | CLEANING LIQUID AND SUBSTRATE CLEANING METHOD | 東京応化工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20230174892-A1 | DETERGENT COMPOSITION AND CHEMICAL-MECHANICAL POLISHING COMPOSITION | DAICEL CORPORATION (JP) | 2023-06-08 | — | — | US | disclosed |
| CN-115516073-A | Cleaning agent composition and chemical mechanical polishing composition | 株式会社大赛璐 | 2022-12-23 | — | — | CN | disclosed |
| US-11385548-B2 | Process liquid and method of processing substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-12 | — | — | US | disclosed |
| US-20200241424-A1 | PROCESS LIQUID AND METHOD OF PROCESSING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-30 | — | — | US | disclosed |
| EP-3228730-A1 | ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITE | MEC COMPANY LTD. (JP) | 2017-10-11 | — | — | EP | disclosed |
| US-20170268112-A1 | ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITE | MEC COMPANY LTD. (JP) | 2017-09-21 | — | — | US | disclosed |
| CN-107018669-A | The manufacture method of etchant and its bulking liquor, the method for coarsening surface of magnesium component and magnesium-resin composite body | MEC股份有限公司 | 2017-08-04 | — | — | CN | disclosed |
| EP-2475000-B1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEM IND LTD (JP) | 2015-07-01 | — | — | EP | disclosed |
| US-9034810-B2 | Processing agent composition for semiconductor surface and method for processing semiconductor surface using same | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| US-9006164-B2 | Resist remover composition and method for removing resist using the composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-04-14 | — | — | US | disclosed |
| EP-2474862-B1 | COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEM IND LTD (JP) | 2015-02-25 | — | — | EP | disclosed |
| EP-2474862-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| EP-2475000-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-20120172274-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120157368-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-21 | — | — | US | disclosed |