⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL269058 | 0.80 | — | — | |
| SCHEMBL270682 | 0.75 | — | — | |
| SCHEMBL2886957 | 0.73 | — | — | |
| SCHEMBL2599355 | 0.73 | — | — | |
| SCHEMBL28505758 | 0.72 | — | — | |
| SCHEMBL39300 | 0.71 | — | — | |
| SCHEMBL51681 | 0.71 | — | — | |
| SCHEMBL26776 | 0.71 | — | — | |
| SCHEMBL31054487 | 0.70 | — | — | |
| SCHEMBL11430726 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024095926-A1 | CLEANING LIQUID AND SUBSTRATE CLEANING METHOD | 東京応化工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20230174892-A1 | DETERGENT COMPOSITION AND CHEMICAL-MECHANICAL POLISHING COMPOSITION | DAICEL CORPORATION (JP) | 2023-06-08 | — | — | US | disclosed |
| US-10597616-B2 | Cleaning liquid and method for manufacturing the same | TOYOTA OHKA KOGYO CO., LTD. (JP) | 2020-03-24 | — | — | US | disclosed |
| US-10597609-B2 | Cleaning liquid, anticorrosion agent, and method for manufacturing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-03-24 | — | — | US | disclosed |
| US-20180187128-A1 | CLEANING LIQUID, ANTICORROSION AGENT, AND METHOD FOR MANUFACTURING THE SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| US-20180187133-A1 | CLEANING LIQUID AND METHOD FOR MANUFACTURING THE SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| EP-2475000-B1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEM IND LTD (JP) | 2015-07-01 | — | — | EP | disclosed |
| US-9034810-B2 | Processing agent composition for semiconductor surface and method for processing semiconductor surface using same | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| US-9006164-B2 | Resist remover composition and method for removing resist using the composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-04-14 | — | — | US | disclosed |
| EP-2474862-B1 | COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEM IND LTD (JP) | 2015-02-25 | — | — | EP | disclosed |
| EP-2475000-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| EP-2474862-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-20120172274-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120157368-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-21 | — | — | US | disclosed |