SCHEMBL9938853

SCHEMBL9938853

CCCCCCCCCCCCCCC(C)CCCCF

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.52
OPRM1 P35372 1/20 0.44
LMNA P02545 2/20 0.42
SPHK1 Q9NYA1 1/20 0.41
PRKD3 O94806 1/20 0.41
PRKCG P05129 1/20 0.41
PRKCB P05771 1/20 0.41
PRKCA P17252 1/20 0.41
PRKCH P24723 1/20 0.41
PRKCI P41743 1/20 0.41
PRKCE Q02156 1/20 0.41
PRKCQ Q04759 1/20 0.41
PRKCZ Q05513 1/20 0.41
PRKCD Q05655 1/20 0.41
PRKD1 Q15139 1/20 0.41
DNM1 Q05193 5/20 0.40
MAPT P10636 1/20 0.40
TSHR P16473 1/20 0.40
THRB P10828 1/20 0.40
ADH1B P00325 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10608045 1.00 ACE2 (0.52) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL19026470 1.00 ACE2 (0.52) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL8173119 1.00 ACE2 (0.52) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL21539632 0.90 ACE2 (0.52) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL22268864 0.90 ACE2 (0.42) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL20506768 0.87 ACE2 (0.62) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL20506761 0.87 ACE2 (0.62) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL20506759 0.87 ACE2 (0.62) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL20835139 0.87 ACE2 (0.62) ACE2OPRM1LMNASPHK1PRKD3
SCHEMBL20506756 0.87 ACE2 (0.62) ACE2OPRM1LMNASPHK1PRKD3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2652753-B1 DIELECTRIC INSULATION MEDIUM ABB TECHNOLOGY AG (CH) 2015-08-26 EP claimed
EP-2652751-B1 DIELECTRIC INSULATION MEDIUM ABB RESEARCH LTD (CH) 2015-02-25 EP claimed
US-8709303-B2 Dielectric insulation medium ABB RESEARCH LTD. (CH) 2014-04-29 US claimed
EP-2652753-A1 DIELECTRIC INSULATION MEDIUM ABB Technology AG (CH) 2013-10-23 EP claimed
EP-2652751-A1 DIELECTRIC INSULATION MEDIUM ABB Research Ltd. (CH) 2013-10-23 EP claimed
US-20130265692-A1 Dielectric Insulation Medium ABB RESEARCH LTD. (CH) 2013-10-10 US claimed
US-20130221292-A1 Dielectric Insulation Medium ABB TECHNOLOGY AG (CH) 2013-08-29 US claimed
WO-2012080222-A1 DIELECTRIC INSULATION MEDIUM ABB RESEARCH LTD (CH) 2012-06-21 WO claimed
WO-2012080269-A1 DIELECTRIC INSULATION MEDIUM ABB TECHNOLOGY AG (CH) 2012-06-21 WO claimed
CN-116323272-B Thermal conditioning of batteries by immersion in liquid compositions 阿科玛法国公司 2026-05-19 CN disclosed
CN-118973549-A Compositions suitable for high oil content 莱雅公司 2024-11-15 CN disclosed
CN-118900679-A Cosmetic composition comprising a particulate cellulose compound, hydrophobic silica aerogel particles, a semi-crystalline polymer and a wax of vegetable origin 欧莱雅公司 2024-11-05 CN disclosed
CN-118871078-A Cosmetic or dermatological composition comprising at least a merocyanine and a hydrotrope 欧莱雅 2024-10-29 CN disclosed
CN-118804735-A Cosmetic and/or dermatological composition comprising at least one merocyanine and at least ascorbic acid and/or derivatives thereof 莱雅公司 2024-10-18 CN disclosed
EP-2652751-A1 DIELECTRIC INSULATION MEDIUM ABB Research Ltd. (CH) 2013-10-23 EP disclosed
EP-2652753-A1 DIELECTRIC INSULATION MEDIUM ABB Technology AG (CH) 2013-10-23 EP disclosed
US-20130265692-A1 Dielectric Insulation Medium ABB RESEARCH LTD. (CH) 2013-10-10 US disclosed
US-20130221292-A1 Dielectric Insulation Medium ABB TECHNOLOGY AG (CH) 2013-08-29 US disclosed
WO-2012080269-A1 DIELECTRIC INSULATION MEDIUM ABB TECHNOLOGY AG (CH) 2012-06-21 WO disclosed
WO-2012080222-A1 DIELECTRIC INSULATION MEDIUM ABB RESEARCH LTD (CH) 2012-06-21 WO disclosed