Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.68 |
| ▸ | KDM5C | P41229 | 1/20 | 0.68 |
| ▸ | PHF8 | Q9UPP1 | 1/20 | 0.68 |
| ▸ | KDM2A | Q9Y2K7 | 1/20 | 0.68 |
| ▸ | TSHR | P16473 | 4/20 | 0.60 |
| ▸ | LMNA | P02545 | 3/20 | 0.60 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.60 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.57 |
| ▸ | MEN1 | O00255 | 2/20 | 0.54 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.54 |
| ▸ | PLG | P00747 | 1/20 | 0.54 |
| ▸ | THRB | P10828 | 1/20 | 0.54 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.54 |
| ▸ | RECQL | P46063 | 1/20 | 0.54 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.54 |
| ▸ | GAA | P10253 | 1/20 | 0.53 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.50 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Pimelic Acid SCHEMBL28098037 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL2296329 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL28793415 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL3824093 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL994875 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL992054 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL582192 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL19837430 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| Sebacic Acid SCHEMBL30552788 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR | |
| SCHEMBL28098075 | 1.00 | KDM4E (0.68) | KDM4EKDM5CPHF8KDM2ATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3354688-B1 | POLYACETAL RESIN COMPOSITION AND MOLDED BODY THEREOF | ASAHI CHEMICAL IND (JP) | 2024-03-13 | — | — | EP | disclosed |
| CN-109679275-B | Polyacetal resin composition | 旭化成株式会社 | 2022-03-01 | — | — | CN | disclosed |
| CN-108026352-B | Polyacetal resin composition and molded article thereof | 旭化成株式会社 | 2020-07-03 | — | — | CN | disclosed |
| US-20180265695-A1 | POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-09-20 | — | — | US | disclosed |
| EP-3354688-A1 | POLYACETAL RESIN COMPOSITION AND MOLDED BODY THEREOF | Asahi Kasei Kabushiki Kaisha (JP) | 2018-08-01 | — | — | EP | disclosed |
| US-8765850-B2 | Polyacetal resin composition and preparation process thereof | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2014-07-01 | — | — | US | disclosed |
| EP-2267075-B1 | POLYACETAL RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME | ASAHI KASEI CHEMICALS CORP (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-8546299-B2 | Color-developing composition and recording material containing the same | NIPPON SODA CO., LTD. (JP) | 2013-10-01 | — | — | US | disclosed |
| EP-2014688-B1 | Thermosensitive adhesive material | RICOH CO LTD (JP) | 2012-05-30 | — | — | EP | disclosed |
| EP-1674543-B1 | Heat-sensitive adhesive material | RICOH CO LTD (JP) | 2011-08-17 | — | — | EP | disclosed |
| US-20090017299-A1 | THERMOSENSITIVE ADHESIVE MATERIAL | RICOH COMPANY, LTD (JP) | 2009-01-15 | — | — | US | disclosed |
| EP-2014688-A1 | Thermosensitive adhesive material | Ricoh Company, Ltd. (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-20080026205-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2008-01-31 | — | — | US | disclosed |
| EP-1882726-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2008-01-30 | — | — | EP | disclosed |
| US-20060159913-A1 | Heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2006-07-20 | — | — | US | disclosed |
| EP-1674543-A1 | Heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2006-06-28 | — | — | EP | disclosed |
| EP-0211978-B1 | Method for preparing a solventless thermoset polymeric composition | NICHOLS GUS (US) | 1994-07-20 | — | — | EP | disclosed |
| US-4675374-A | Solventless polymeric composition reaction product of (1) adduct of amine and acrylate with (2) polyacrylate | NICHOLS GUS | 1987-06-23 | — | — | US | disclosed |
| EP-0211978-A1 | Method for preparing a solventless thermoset polymeric composition | Nichols, Gus (US) | 1987-03-04 | — | — | EP | disclosed |
| US-4547562-A | Solventless polymeric composition comprising non arylamine, polyacrylate and epoxide | NICHOLS GUS | 1985-10-15 | — | — | US | disclosed |