SCHEMBL9945784

SCHEMBL9945784

CCC(C)C(=O)OC1CCC(C(C)(C)C)CC1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APOBEC3A P31941 1/20 0.46
APOBEC3G Q9HC16 1/20 0.46
SMN1; SMN2 Q16637 4/20 0.44
HTT P42858 3/20 0.44
KDM4E B2RXH2 2/20 0.44
CYP19A1 P11511 1/20 0.43
MAPT P10636 3/20 0.43
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
GAA P10253 2/20 0.40
MEN1 O00255 4/20 0.39
KMT2A Q03164 4/20 0.39
HSD11B1 P28845 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.35
LIPA P38571 1/20 0.35
CYP2D6 P10635 1/20 0.34
KCNH2 Q12809 1/20 0.34
HRH3 Q9Y5N1 1/20 0.34
TSHR P16473 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18253412 0.89 APOBEC3A (0.35) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL10900145 0.88 CHRM2 (0.38) SMN1; SMN2KDM4ECYP19A1GAAMEN1
SCHEMBL12326349 0.87 APOBEC3A (0.43) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL17515458 0.87 APOBEC3A (0.35) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL18253345 0.84 APOBEC3A (0.32) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL16787975 0.83 CHRM2 (0.35) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL1627279 0.83 APOBEC3A (0.33) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL18253325 0.83 APOBEC3A (0.35) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL18253332 0.83 CHRM2 (0.33) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E
SCHEMBL1628101 0.82 MAPT (0.47) APOBEC3AAPOBEC3GSMN1; SMN2HTTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11795334-B2 Photo-curable ink composition and method for forming image FUJIFILM CORPORATION (JP) 2023-10-24 US disclosed
US-20180175299-A1 ORGANIC THIN FILM TRANSISTOR, METHOD OF MANUFACTURING ORGANIC THIN FILM TRANSISTOR, ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC SEMICONDUCTOR FILM, AND METHOD OF MANUFACTURING ORGANIC SEMICONDUCTOR FILM FUJIFILM CORPORATION (JP) 2018-06-21 US disclosed
US-20180162979-A1 PHOTOSENSITIVE COMPOSITION, IMAGE FORMING METHOD, FILM FORMING METHOD, RESIN, IMAGE, AND FILM FUJIFILM CORPORATION (JP) 2018-06-14 US disclosed
US-20180051149-A1 HARDCOAT FILM, POLARIZING PLATE, AND TOUCH PANEL DISPLAY FUJIFILM CORPORATION (JP) 2018-02-22 US disclosed
US-9718976-B2 Ink composition for inkjet recording, inkjet recording method, and printed matter FUJIFILM CORPORATION (JP) 2017-08-01 US disclosed
US-9612535-B2 Pattern forming method, electron beam- or extreme ultraviolet-sensitive resin composition, resist film using the same, method of manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-04-04 US disclosed
US-9568824-B2 Actinic-ray- or radiation-sensitive resin composition, resist film therefrom and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2017-02-14 US disclosed
US-9441127-B2 Polymerizable composition, ink composition for ink-jet recording, method of ink-jet recording, and printed article FUJIFILM CORPORATION (JP) 2016-09-13 US disclosed
US-9429840-B2 Pattern forming method, composition used therein, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-08-30 US disclosed
US-9405197-B2 Pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-08-02 US disclosed
US-20110014570-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2011-01-20 US disclosed
US-20110007123-A1 THERMAL TRANSFER SHEET AND IMAGE FORMATION METHOD USING SAME FUJIFILM CORPORATION (JP) 2011-01-13 US disclosed
US-7785767-B2 photoresist films suitable for immersion exposure, comprising non-aromatic olefin polymers, acid generators, solvents and acrylic polymers or vinyl ether polymers, having good followability for water, improved profile and pattern collapse FUJIFILM CORPORATION (JP) 2010-08-31 US disclosed
US-7666574-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2010-02-23 US disclosed
US-20100015554-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2010-01-21 US disclosed
US-7550250-B2 Resin having a monocyclic or polycyclic alicyclic hydrocarbon structure, of which solubility in an alkali developer increases under an action of an acid, a photoacid generator, methacrylic resins having hydrolysable ester groups and solvent; profiles; pattern collapse; immersion exposure; ARF lasers FUJIFILM CORPORATION (JP) 2009-06-23 US disclosed
US-20090136878-A1 TOPCOAT COMPOSITION, ALKALI DEVELOPER-SOLUBLE TOPCOAT FILM USING THE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-05-28 US disclosed
US-20090098485-A1 photoresist films suitable for immersion exposure, comprising non-aromatic olefin polymers, acid generators, solvents and acrylic polymers or vinyl ether polymers, having good followability for water, improved profile and pattern collapse FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20080241746-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed
US-20070148595-A1 Resin having a monocyclic or polycyclic alicyclic hydrocarbon structure, of which solubility in an alkali developer increases under an action of an acid, a photoacid generator, methacrylic resins having hydrolysable ester groups and solvent; profiles; pattern collapse; immersion exposure; ARF lasers FUJIFILM CORPORATION (JP) 2007-06-28 US disclosed