SCHEMBL9950581

SCHEMBL9950581

COCCOCCOCCOCCOCC(C)OC

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.34
CA2 P00918 1/20 0.32
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27761630 1.00 TDP1 (0.34) TDP1CA2HSD17B10
SCHEMBL27388544 1.00 TDP1 (0.34) TDP1CA2HSD17B10
SCHEMBL9576507 0.97 TDP1 (0.35) TDP1HSD17B10
SCHEMBL13377398 0.97 TDP1 (0.35) TDP1HSD17B10
SCHEMBL18419627 0.92 TDP1 (0.38) TDP1HSD17B10
SCHEMBL25658286 0.89 TDP1 (0.39) TDP1HSD17B10
SCHEMBL28986979 0.84 TDP1 (0.35) TDP1
SCHEMBL27082951 0.84 TDP1 (0.35) TDP1
SCHEMBL15106867 0.84 PIK3CD (0.33)
SCHEMBL19417853 0.83 TDP1 (0.52) TDP1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2658940-A2 COMPOSITION OF ECO-FRIENDLY HOT MELT ADHESIVE SK Innovation Co., Ltd. (KR) 2013-11-06 EP disclosed
US-8426507-B2 Composition of eco-friendly hot melt adhesive SK INNOVATION CO., LTD. (KR) 2013-04-23 US disclosed
WO-2012091327-A2 COMPOSITION OF ECO-FRIENDLY HOT MELT ADHESIVE SK INNOVATION CO., LTD. (KR) 2012-07-05 WO disclosed
US-20120165441-A1 Composition of Eco-Friendly Hot Melt Adhesive SK INNOVATION CO., LTD. (KR) 2012-06-28 US disclosed