SCHEMBL9958647

SCHEMBL9958647

O=C(O)CC(S)CC(CO)(CC(S)CC(=O)O)C(CO)CO

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9958764 0.74 SLC22A6 (0.33) SLC22A6
SCHEMBL6890278 0.71
SCHEMBL16581465 0.71 SLC22A6 (0.31) SLC22A6
SCHEMBL536898 0.69 OR51E2 (0.48)
SCHEMBL8943734 0.69 SLC22A6 (0.36) SLC22A6
SCHEMBL2811956 0.68 SLC22A6 (0.50) SLC22A6
SCHEMBL17873325 0.68
SCHEMBL9958152 0.68
SCHEMBL1255080 0.68
SCHEMBL6740877 0.66 SLC22A6 (0.47) SLC22A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed