SCHEMBL997156

SCHEMBL997156

CCCCCCCCCCCCCCCCCCOC(c1c(C(C)(C)C)cc(C)cc1C(C)(C)C)C(CO)(CO)CO

nearest known ligand 0.42

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 8/20 0.36
CNR1 P21554 7/20 0.36
THRA P10827 1/20 0.35
THRB P10828 1/20 0.35
ALDH1A1 P00352 1/20 0.33
CA2 P00918 1/20 0.33
POLB P06746 1/20 0.33
TYR P14679 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL995780 1.00 CNR2 (0.36) CNR2CNR1THRATHRBALDH1A1
SCHEMBL4932470 0.88 CNR2 (0.37) CNR2CNR1THRATHRB
SCHEMBL11151864 0.88 CNR2 (0.37) CNR2CNR1THRATHRB
SCHEMBL995101 0.87 RARB (0.33) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL996747 0.87 RARB (0.33) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL11376574 0.87 RARB (0.33) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL27801953 0.86 S1PR1 (0.38) CNR2CNR1THRATHRB
SCHEMBL27822657 0.86 S1PR1 (0.38) CNR2CNR1THRATHRB
SCHEMBL11149920 0.78 HSPA5 (0.33)
SCHEMBL995277 0.77 SMN1; SMN2 (0.41) ALDH1A1CA2POLBTYRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
WO-2023203819-A1 MOLDED ARTICLE, WELDING METHOD, AND METHOD FOR PRODUCING MOLDED ARTICLE 旭化成株式会社 2023-10-26 WO disclosed
EP-3604447-B1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2023-08-16 EP disclosed
US-11192979-B2 Polyamide composition and molded article ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-12-07 US disclosed
CN-112601776-A Polyamide and polyamide composition 株式会社可乐丽 2021-04-02 CN disclosed
US-10815377-B2 Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2020-10-27 US disclosed
EP-3081598-B1 POLYAMIDE COMPOSITION, MOLDED ARTICLE, REFLECTIVE BOARD FOR LEDS, AND METHOD FOR PREVENTING HEAT-INDUCED REFLECTIVITY REDUCTION ASAHI CHEMICAL IND (JP) 2020-06-10 EP disclosed
US-20200087458-A1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-03-19 US disclosed
EP-3604447-A1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2020-02-05 EP disclosed
US-20180298190-A1 RESIN COMPOSITION, RESIN MOLDING, METHOD FOR MANUFACTURING PLATED RESIN MOLDING, AND METHOD FOR MANUFACTURING ANTENNA-EQUIPPED PORTABLE ELECTRONIC DEVICE PART MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2018-10-18 US disclosed
EP-2662397-A1 COPOLYMER POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2013-11-13 EP disclosed
US-20130281655-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORP (JP) 2013-10-24 US disclosed
US-20130261256-A1 COPOLYMER POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-10-03 US disclosed
US-8487024-B2 Polyamide, polyamide composition, and method for producing polyamide ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-07-16 US disclosed
EP-2476717-A1 POLYAMIDE AND POLYAMIDE COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2012-07-18 EP disclosed
US-20120165466-A1 POLYAMIDE AND POLYAMIDE COMPOSITION ASAHI KASEI CHEMICALS CORPORATION (JP) 2012-06-28 US disclosed
US-20110028614-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2011-02-03 US disclosed
EP-2270067-A1 POLYAMIDE, POLYAMIDE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2011-01-05 EP disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed