SCHEMBL997452

SCHEMBL997452

COC(C)OC([SiH3])=C(OC(C)OC)OC(C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9790347 0.82
SCHEMBL9790344 0.76
SCHEMBL28622347 0.70
SCHEMBL984063 0.69 TSHR (0.36)
SCHEMBL540124 0.69 TSHR (0.36)
SCHEMBL577005 0.67
SCHEMBL28490351 0.65 TSHR (0.33)
SCHEMBL4390936 0.64
SCHEMBL16809088 0.63 TSHR (0.43)
SCHEMBL2370431 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7183354-B2 Room temperature curable functionalized HNBR coating LORD CORPORATION (US) 2007-02-27 US claimed
EP-3253583-B1 THERMAL MANAGEMENT MATERIALS CONTAINING PHASE CHANGE MATERIALS LATENT HEAT SOLUTIONS LLC (US) 2023-11-29 EP disclosed
EP-3254331-B1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTROCHEMICAL DEVICE THERMAL MANAGEMENT LATENT HEAT SOLUTIONS LLC (US) 2023-05-10 EP disclosed
WO-2022250456-A1 HIGH-VOLTAGE CABLE MATERIAL AND MANUFACTURING METHOD THEREFOR 한국생산기술연구원 2022-12-01 WO disclosed
EP-4086082-A1 THERMAL MANAGEMENT MATERIAL FOR THERMAL MANAGEMENT Latent Heat Solutions, LLC (US) 2022-11-09 EP disclosed
US-11411262-B2 Systems, structures and materials for electrochemical device thermal management LATENT HEAT SOLUTIONS, LLC (US) 2022-08-09 US disclosed
EP-2217827-B1 SUSPENSION SYSTEM FOR AIRCRAFT AUXILIARY POWER UNIT WITH ELASTOMERIC MEMBER LORD CORP (US) 2020-06-03 EP disclosed
US-10431858-B2 Systems, structures and materials for electrochemical device thermal management LATENT HEAT SOLUTIONS, LLC 2019-10-01 US disclosed
EP-1984178-B1 COATED ARTICLES FORMED OF MICROCAPSULES WITH REACTIVE FUNCTIONAL GROUPS OUTLAST TECH LLC (US) 2019-08-07 EP disclosed
EP-2877803-B1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING OUTLAST TECH LLC (US) 2019-05-29 EP disclosed
US-6270900-B1 FOR VARIOUS KINDS OF WIRING BOARDS SUCH AS WIRING FILMS FOR SEMICONDUCTOR PACKAGES, FOR FLEXIBLE PRINTED WIRING BOARDS AND WIRING FILMS FOR SEMICONDUCTOR MOUNTING NIPPON ZEON CO., LTD. (JP) 2001-08-07 US disclosed
EP-1025989-A1 COMPOSITE FILM NIPPON ZEON CO., LTD. (JP) 2000-08-09 EP disclosed
EP-0997482-A1 MODIFIED CYCLOOLEFIN ADDITION POLYMER AND CURABLE RESIN COMPOSITION CONTAINING THE SAME NIPPON ZEON CO., LTD. (JP) 2000-05-03 EP disclosed
EP-0995784-A1 ADHESIVE FOR SEMICONDUCTOR COMPONENTS NIPPON ZEON CO., LTD. (JP) 2000-04-26 EP disclosed
US-5773509-A BLEND OF POLYIMIDE AND EPOXY COMPOUND SUMITOMO BAKELITE COMPANY LIMITED (JP) 1998-06-30 US disclosed
EP-0311722-B1 SILANE-MODIFIED ETHYLENE COPOLYMER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE COMPRISING THE SAME CRAY VALLEY SA (FR) 1991-09-18 EP disclosed
EP-0185526-B1 SOLVENT SOLUBLE FLUORINE-CONTAINING POLYMER, COATING COMPOSITION CONTAINING THE SAME AND COATING PROCESS THEREOF MITSUI SEKIYU KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1991-03-13 EP disclosed
EP-0196528-B1 AROMATIC POLYESTER FILM HAVING SILICONE RESIN LAYER AND LIQUID CRYSTAL DISPLAY PANEL MADE THEROF KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1990-08-08 EP disclosed
EP-0311722-A1 Silane-modified ethylene copolymer, process for producing the same, and adhesive comprising the same CRAY VALLEY SA (FR) 1989-04-19 EP disclosed
US-4738880-A SOLVENT RESISTANT, RADIATION TRANSPARENT PROTECTIVE COATING KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-04-19 US disclosed