⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30441705 | 0.87 | — | — | |
| SCHEMBL29263409 | 0.82 | — | — | |
| SCHEMBL29493546 | 0.82 | — | — | |
| SCHEMBL29405529 | 0.82 | — | — | |
| SCHEMBL82088 | 0.82 | — | — | |
| SCHEMBL9340102 | 0.82 | — | — | |
| SCHEMBL9132777 | 0.82 | — | — | |
| SCHEMBL29351697 | 0.82 | — | — | |
| SCHEMBL31513100 | 0.82 | — | — | |
| SCHEMBL28844086 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11227719-B2 | Leadless multi-layered ceramic capacitor stack | KEMET ELECTRONICS CORPORATION (US) | 2022-01-18 | — | — | US | disclosed |
| US-10984955-B2 | Electronic component structures with reduced microphonic noise | KEMET ELECTRONICS CORPORATION (US) | 2021-04-20 | — | — | US | disclosed |
| US-10790094-B2 | Method of forming a leadless stack comprising multiple components | KEMET ELECTRONICS CORPORATION (US) | 2020-09-29 | — | — | US | disclosed |
| EP-3664958-A1 | LEADLESS STACK COMPRISING MULTIPLE COMPONENTS | Kemet Electronics Corporation (US) | 2020-06-17 | — | — | EP | disclosed |
| US-20190318877-A1 | Leadless Stack Comprising Multiple Components | KEMET ELECTRONICS CORPORATION | 2019-10-17 | — | — | US | disclosed |
| US-20190304698-A1 | Electronic Component Structures with Reduced Microphonic Noise | KEMET ELECTRONICS CORPORATION | 2019-10-03 | — | — | US | disclosed |
| US-10381162-B2 | Leadless stack comprising multiple components | KEMET ELECTRONICS CORPORATION (US) | 2019-08-13 | — | — | US | disclosed |
| US-10366836-B2 | Electronic component structures with reduced microphonic noise | KEMET ELECTRONICS CORPORATION (US) | 2019-07-30 | — | — | US | disclosed |
| WO-2019032294-A1 | LEADLESS STACK COMPRISING MULTIPLE COMPONENTS | KEMET ELECTRONICS CORPORATION (US) | 2019-02-14 | — | — | WO | disclosed |
| US-10068707-B2 | Leadless multi-layered ceramic capacitor stacks | KEMET ELECTRONICS CORPORATION (US) | 2018-09-04 | — | — | US | disclosed |
| EP-2577694-B1 | ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES | KEMET ELECTRONICS CORP (US) | 2016-03-16 | — | — | EP | disclosed |
| US-20160071650-A1 | Leadless Multi-Layered Ceramic Capacitor Stacks | KEMET ELECTRONICS CORPORATION | 2016-03-10 | — | — | US | disclosed |
| EP-2923366-A1 | LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS | Kemet Electronics Corporation (US) | 2015-09-30 | — | — | EP | disclosed |
| US-8902565-B2 | Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes | KEMET ELECTRONICS CORPORATION (US) | 2014-12-02 | — | — | US | disclosed |
| WO-2014081666-A1 | LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS | KEMET ELECTRONICS CORPORATION (US) | 2014-05-30 | — | — | WO | disclosed |
| US-20140002952-A1 | Leadless Multi-Layered Ceramic Capacitor Stacks | Kemet Electrinics Corporation (US) | 2014-01-02 | — | — | US | disclosed |
| EP-2577694-A2 | ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES | Kemet Electronics Corporation (US) | 2013-04-10 | — | — | EP | disclosed |
| CN-101787463-B | Lead-free-cutting zinc white copper and preparation method thereof | NINGBO POWERWAY ALLOY MATERIALS CO LTD | 2012-04-25 | — | — | CN | disclosed |
| WO-2011150246-A2 | ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES | KEMET ELECTRONICS CORPORATION (US) | 2011-12-01 | — | — | WO | disclosed |
| CN-101787463-A | Environmentally-friendly lead-free free-machining zinc white copper and preparation method thereof | NINGBO POWERWAY GROUP CO LTD | 2010-07-28 | — | — | CN | disclosed |