SCHEMBL998653

SCHEMBL998653

[Co].[Cu].[LiH].[O-2].[O-2].[Sn].[Ti+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1000517 0.91
SCHEMBL1000807 0.82
SCHEMBL16535478 0.71
SCHEMBL30043165 0.71
SCHEMBL96848 0.71
SCHEMBL2803613 0.71
SCHEMBL9813689 0.71
SCHEMBL998929 0.71
SCHEMBL7613148 0.71
SCHEMBL5826078 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2011008539-A2 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2011-01-20 WO disclosed
US-20100330425-A1 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2010-12-30 US disclosed