⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1000518 | 0.93 | — | — | |
| SCHEMBL27861903 | 0.86 | — | — | |
| SCHEMBL1000808 | 0.84 | — | — | |
| SCHEMBL15844256 | 0.84 | — | — | |
| SCHEMBL29220064 | 0.84 | — | — | |
| SCHEMBL1471405 | 0.77 | — | — | |
| SCHEMBL29011854 | 0.77 | — | — | |
| SCHEMBL28793720 | 0.77 | — | — | |
| SCHEMBL25187006 | 0.76 | — | — | |
| SCHEMBL160067 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20120237823-A1 | POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS | APPLIED MATERIALS, INC. (US) | 2012-09-20 | — | — | US | claimed |
| US-20100330425-A1 | PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE | APPLIED MATERIALS, INC. (US) | 2010-12-30 | — | — | US | claimed |
| US-9567683-B2 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors | APPLIED MATERIALS, INC. (US) | 2017-02-14 | — | — | US | disclosed |
| US-20120237823-A1 | POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS | APPLIED MATERIALS, INC. (US) | 2012-09-20 | — | — | US | disclosed |
| US-8206569-B2 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors | APPLIED MATERIALS, INC. (US) | 2012-06-26 | — | — | US | disclosed |
| WO-2011008539-A2 | PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE | APPLIED MATERIALS, INC. (US) | 2011-01-20 | — | — | WO | disclosed |
| US-20100330425-A1 | PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE | APPLIED MATERIALS, INC. (US) | 2010-12-30 | — | — | US | disclosed |
| US-20100193365-A1 | POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS | APPLIED MATERIALS, INC. (US) | 2010-08-05 | — | — | US | disclosed |