SCHEMBL999399

SCHEMBL999399

O=[AlH].[Co].[Cu].[LiH].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25167611 0.93
SCHEMBL333731 0.93
SCHEMBL28297630 0.93
SCHEMBL20481526 0.93
SCHEMBL998776 0.93
SCHEMBL28230349 0.86
SCHEMBL3454575 0.86
SCHEMBL25240203 0.86
SCHEMBL28491011 0.86
SCHEMBL1069030 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120237823-A1 POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS APPLIED MATERIALS, INC. (US) 2012-09-20 US claimed
CN-102449841-A Passivation film for solid electrolyte interface of three dimensional copper containing electrode in energy storage device APPLIED MATERIALS INC 2012-05-09 CN claimed
WO-2011008539-A2 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2011-01-20 WO claimed
US-20100330425-A1 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2010-12-30 US claimed
US-9567683-B2 Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors APPLIED MATERIALS, INC. (US) 2017-02-14 US disclosed
CN-102379050-B Porous three-dimensional copper, tin, copper tin cobalt, and copper tin cobalt titanium electrodes for batteries and ultracapacitors APPLIED MATERIALS INC 2014-06-11 CN disclosed
US-20120237823-A1 POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS APPLIED MATERIALS, INC. (US) 2012-09-20 US disclosed
US-8206569-B2 Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors APPLIED MATERIALS, INC. (US) 2012-06-26 US disclosed
CN-102449841-A Passivation film for solid electrolyte interface of three dimensional copper containing electrode in energy storage device APPLIED MATERIALS INC 2012-05-09 CN disclosed
CN-102379050-A Porous three-dimensional copper, tin, copper tin cobalt, and copper tin cobalt titanium electrodes for batteries and ultracapacitors APPLIED MATERIALS INC 2012-03-14 CN disclosed
EP-2394322-A2 POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS Applied Materials, Inc. (US) 2011-12-14 EP disclosed
WO-2011008539-A2 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2011-01-20 WO disclosed
US-20100330425-A1 PASSIVATION FILM FOR SOLID ELECTROLYTE INTERFACE OF THREE DIMENSIONAL COPPER CONTAINING ELECTRODE IN ENERGY STORAGE DEVICE APPLIED MATERIALS, INC. (US) 2010-12-30 US disclosed
WO-2010090956-A2 POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS APPLIED MATERIALS, INC. (US) 2010-08-12 WO disclosed
US-20100193365-A1 POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS APPLIED MATERIALS, INC. (US) 2010-08-05 US disclosed