⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13038467 | 0.93 | ESR1 (0.32) | — | |
| SCHEMBL296516 | 0.91 | ESR1 (0.33) | — | |
| SCHEMBL18143553 | 0.89 | ESR1 (0.32) | — | |
| SCHEMBL31344407 | 0.89 | ESR1 (0.32) | — | |
| SCHEMBL12268484 | 0.89 | ESR1 (0.32) | — | |
| SCHEMBL10015519 | 0.88 | — | — | |
| SCHEMBL12032190 | 0.86 | — | — | |
| SCHEMBL17717346 | 0.86 | — | — | |
| SCHEMBL16772229 | 0.86 | ESR1 (0.31) | — | |
| SCHEMBL2600704 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10040924-B2 | Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-08-07 | — | — | US | disclosed |
| US-20180025958-A1 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| US-20170121504-A1 | ADHESION PROMOTER, ADDITION CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-05-04 | — | — | US | disclosed |
| US-20170110415-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-04-20 | — | — | US | disclosed |
| US-20170098551-A1 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD FOR MANUFACTURING BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-04-06 | — | — | US | disclosed |
| US-9449856-B2 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-09-20 | — | — | US | disclosed |
| US-20160141268-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-05-19 | — | — | US | disclosed |
| US-9312197-B2 | Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-12 | — | — | US | disclosed |
| US-20160043012-A1 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS | SHINETSU CHEMICAL CO (JP) | 2016-02-11 | — | — | US | disclosed |
| US-20160035638-A1 | SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTED THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMED THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| US-20150235871-A1 | VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-08-20 | — | — | US | disclosed |
| US-20150028497-A1 | ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-01-29 | — | — | US | disclosed |
| US-20140329363-A1 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-11-06 | — | — | US | disclosed |
| US-8872358-B2 | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-28 | — | — | US | disclosed |
| US-20140264956-A1 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-09-18 | — | — | US | disclosed |
| US-8823186-B2 | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-09-02 | — | — | US | disclosed |
| US-20130200534-A1 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-08 | — | — | US | disclosed |
| US-20120161339-A1 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-28 | — | — | US | disclosed |
| US-20120043577-A1 | CURABLE SILICONE RESIN COMPOSITION AND LIGHT-EMITTING DIODE DEVICE USING THE SAME | SHIN-ETSU CEMICAL CO., LTD. (JP) | 2012-02-23 | — | — | US | disclosed |
| US-20110140289-A1 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |