SCHEMBL10015519

SCHEMBL10015519

C=C[Si](C)(C)O[Si](C)(C=C)O[Si](C)(O[Si](C)(C)C=C)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9007134 0.93
SCHEMBL296516 0.93 ESR1 (0.33)
SCHEMBL17704576 0.92
SCHEMBL17717347 0.92
SCHEMBL16788916 0.92
SCHEMBL12268484 0.91 ESR1 (0.32)
SCHEMBL18143553 0.91 ESR1 (0.32)
SCHEMBL15800395 0.90
SCHEMBL10002008 0.88
SCHEMBL16772229 0.87 ESR1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8093333-B2 Hot-melt silicone adhesive DOW CORNING TORAY COMPANY, LTD. (JP) 2012-01-10 US disclosed
US-20090075009-A1 Hot-Melt Silicone Adhesive DOW TORAY CO., LTD. (JP) 2009-03-19 US disclosed