SCHEMBL1002079

SCHEMBL1002079

CCCCCCCCCCCC(OCC1CO1)OCC1CO1

nearest known ligand 0.55

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.55
TDP1 Q9NUW8 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.48
SMPD1 P17405 3/20 0.42
ENPP2 Q13822 1/20 0.38
LPAR2 Q9HBW0 1/20 0.38
EPHX1 P07099 1/20 0.37
SPHK1 Q9NYA1 1/20 0.37
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17102749 1.00 ALDH1A1 (0.55) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL9058587 1.00 ALDH1A1 (0.55) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL2919761 1.00 ALDH1A1 (0.55) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL6563001 1.00 ALDH1A1 (0.55) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL37928 0.98 ALDH1A1 (0.52) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
Propylene Oxide SCHEMBL8468510 0.93 ALDH1A1 (0.47) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL7174552 0.93 ALDH1A1 (0.47) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL1700173 0.92 ALDH1A1 (0.54) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
Bicarbonate SCHEMBL17603243 0.90 ALDH1A1 (0.45) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2
SCHEMBL16593669 0.86 ALDH1A1 (0.45) ALDH1A1TDP1SMN1; SMN2SMPD1ENPP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2003076544-A1 UV-CURABLE EPOXY RESIN COMPOSITION COMPRISING LACTONE MONOMER LUVANTIX CO., LTD. (KR) 2003-09-18 WO claimed
US-20240059827-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC CORPORATION (JP) 2024-02-22 US disclosed
US-20230399504-A1 METHOD OF PRODUCING RESIN AND METHOD OF PRODUCING INSULATING STRUCTURE TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION (JP) 2023-12-14 US disclosed
EP-4261037-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC Corporation (JP) 2023-10-18 EP disclosed
EP-4207562-A1 METHOD FOR PRODUCING RESIN, AND METHOD FOR PRODUCING INSULATING STRUCTURE TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION (JP) 2023-07-05 EP disclosed
EP-4206261-A1 RESIN PRODUCTION METHOD AND INSULATING STRUCTURE PRODUCTION METHOD TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION (JP) 2023-07-05 EP disclosed
WO-2023095615-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC株式会社 2023-06-01 WO disclosed
US-20220356311-A1 METHOD OF PRODUCING RESIN AND METHOD OF PRODUCING INSULATING STRUCTURE TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION (JP) 2022-11-10 US disclosed
US-10066049-B2 Curable composition DAIKIN INDUSTRIES, LTD. (JP) 2018-09-04 US disclosed
US-20160333135-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2016-11-17 US disclosed
EP-1570831-A1 Polymerisable dental material containing a filler Ernst Mühlbauer GmbH & Co.KG (DE) 2005-09-07 EP disclosed
CN-1657988-A Optical waveguide and production method thereof NITTO DENKO CORP (JP) 2005-08-24 CN disclosed
EP-1564565-A2 Optical waveguide and production method thereof NITTO DENKO CORPORATION (JP) 2005-08-17 EP disclosed
WO-2003076544-A1 UV-CURABLE EPOXY RESIN COMPOSITION COMPRISING LACTONE MONOMER LUVANTIX CO., LTD. (KR) 2003-09-18 WO disclosed
EP-0319919-B1 Adhesive composition DAIKIN IND LTD (JP) 1994-03-02 EP disclosed
EP-0295639-B1 Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compounds DAIKIN IND LTD (JP) 1993-12-01 EP disclosed
US-5202360-A Optical adhesive containing photopolymerization initiator or curing agent and having bonding strength, heat and water resistance, low refractive index DAIKEN INDUSTRIES, LTD. (JP) 1993-04-13 US disclosed
US-5157148-A To adhere optical parts DAIKIN INDUSTRIES, LTD. (JP) 1992-10-20 US disclosed
EP-0319919-A2 Adhesive composition DAIKIN INDUSTRIES, LIMITED (JP) 1989-06-14 EP disclosed
EP-0295639-A2 Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compounds DAIKIN INDUSTRIES, LIMITED (JP) 1988-12-21 EP disclosed