SCHEMBL10033489

SCHEMBL10033489

C=CC(=O)OCCOC(=O)CCCl

nearest known ligand 0.57

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.57
ALDH1A1 P00352 4/20 0.57
TP53 P04637 3/20 0.57
HIF1A Q16665 3/20 0.57
HSD17B10 Q99714 1/20 0.57
CYP3A4 P08684 2/20 0.52
THRB P10828 2/20 0.47
HPGD P15428 1/20 0.47
MAPK1 P28482 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
DGKA P23743 1/20 0.35
ADRA2A P08913 1/20 0.33
ADRA1A P35348 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
MAPT P10636 1/20 0.32
BLM P54132 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10033499 0.92 TSHR (0.64) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL28773010 0.92 TSHR (0.59) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL17119709 0.87 TSHR (0.67) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL303596 0.87 TSHR (0.67) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL2459290 0.85 TSHR (0.64) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL9143157 0.85 TSHR (0.64) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL1151178 0.83 TSHR (0.61) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL2534124 0.83 TSHR (0.61) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL2928369 0.83 TSHR (0.61) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL21099519 0.83 TSHR (0.62) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10619248-B2 Conductive laminate for touch panel, touch panel, and transparent conductive laminate FUJIFILM CORPORATION (JP) 2020-04-14 US disclosed
EP-2295505-B1 Ink composition, ink set and image forming method FUJIFILM CORP (JP) 2017-09-27 EP disclosed
EP-3156886-A1 ELECTRICALLY-CONDUCTIVE LAMINATE FOR TOUCHSCREEN, TOUCHSCREEN, AND TRANSPARENT ELECTRICALLY-CONDUCTIVE LAMINATE Fujifilm Corporation (JP) 2017-04-19 EP disclosed
US-20170067165-A1 CONDUCTIVE LAMINATE FOR TOUCH PANEL, TOUCH PANEL, AND TRANSPARENT CONDUCTIVE LAMINATE FUJIFILM CORPORATION (JP) 2017-03-09 US disclosed
US-20170067165-A1 CONDUCTIVE LAMINATE FOR TOUCH PANEL, TOUCH PANEL, AND TRANSPARENT CONDUCTIVE LAMINATE FUJIFILM CORPORATION (JP) 2017-03-09 US disclosed
EP-2247171-B1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORP (JP) 2015-04-22 EP disclosed
US-20130295287-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, AND PROCESS FOR PRODUCING LAMINATE HAVING METAL FILM FUJIFILM CORPORATION (JP) 2013-11-07 US disclosed
US-20130295287-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, AND PROCESS FOR PRODUCING LAMINATE HAVING METAL FILM FUJIFILM CORPORATION (JP) 2013-11-07 US disclosed
US-8511811-B2 Ink composition, ink set and image forming method FUJIFILM CORPORATION (JP) 2013-08-20 US disclosed
US-8511811-B2 Ink composition, ink set and image forming method FUJIFILM CORPORATION (JP) 2013-08-20 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
EP-2133200-A1 CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM Fujifilm Corporation (JP) 2009-12-16 EP disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
EP-2105451-A2 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate Fujifilm Corporation (JP) 2009-09-30 EP disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed