SCHEMBL10033490

SCHEMBL10033490

C=C(C)C(=O)OCOC(=O)C(C)(C)Br

nearest known ligand 0.42

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.42
THRB P10828 1/20 0.40
ALDH1A1 P00352 2/20 0.38
POLB P06746 1/20 0.33
APEX1 P27695 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL711490 0.85 THRB (0.53) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL28162264 0.84 TSHR (0.45) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL5318207 0.83 THRB (0.47) TSHRTHRBALDH1A1HTT
SCHEMBL12319771 0.81 TSHR (0.53) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL148579 0.81 TSHR (0.58) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL12623917 0.80 TSHR (0.61) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL10033488 0.80 THRB (0.58) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL10033502 0.80 THRB (0.58) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL10033503 0.80 THRB (0.58) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL13528759 0.80 TSHR (0.61) TSHRTHRBALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8293846-B2 Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material FUJIFILM CORPORATION (JP) 2012-10-23 US disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100247880-A1 NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100080964-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed