Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.32 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11012846 | 0.89 | TSHR (0.43) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL10033540 | 0.84 | TSHR (0.40) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL4544624 | 0.81 | TSHR (0.38) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL12993045 | 0.78 | TSHR (0.36) | TSHRCYP3A4TDP1SMN1; SMN2 | |
| SCHEMBL31443244 | 0.78 | TSHR (0.39) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL782365 | 0.77 | TSHR (0.39) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL1361080 | 0.77 | CYP3A4 (0.41) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL750654 | 0.77 | TSHR (0.43) | TSHRCYP3A4TDP1MAPTCACNA1B | |
| SCHEMBL24961319 | 0.76 | TSHR (0.56) | TSHRMAPT | |
| SCHEMBL24961365 | 0.76 | TSHR (0.56) | TSHRMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8273463-B2 | Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material | FUJIFILM CORPORATION (JP) | 2012-09-25 | — | — | US | disclosed |
| US-8202576-B2 | Method of forming metal film | FUJIFILM CORPORATION (JP) | 2012-06-19 | — | — | US | disclosed |
| US-20120009385-A1 | RESIN COMPLEX AND LAMINATE | FUJIFILM CORPORATION (JP) | 2012-01-12 | — | — | US | disclosed |
| US-20100279012-A1 | METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME | FUJIFILM CORPORATION (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20100273014-A1 | METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF | FUJIFILM CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |
| US-20100272902-A1 | PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID | FUJIFILM CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |
| US-20100243461-A1 | METHOD OF FABRICATING CIRCUIT BOARD | FUJIFILM CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| US-20100113264-A1 | CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM | FUJIFILM CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-20100080893-A1 | METHOD OF FORMING METAL FILM | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-20100003533-A1 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2010-01-07 | — | — | US | disclosed |
| US-20090269599-A1 | MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090266583-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090214876-A1 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090155553-A1 | Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition | FUJIFILM CORPORATION (JP) | 2009-06-18 | — | — | US | disclosed |