SCHEMBL10040883

SCHEMBL10040883

CCCCCCCCOC(=O)C(C)(C)CC

nearest known ligand 0.53

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.53
EPHX1 P07099 1/20 0.50
TSHR P16473 3/20 0.48
HCAR2 Q8TDS4 1/20 0.46
RAD52 P43351 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
FAAH O00519 1/20 0.44
ALDH1A1 P00352 1/20 0.44
LMNA P02545 1/20 0.44
ACHE P22303 6/20 0.44
LPAR1 Q92633 2/20 0.44
LPAR3 Q9UBY5 2/20 0.44
LPAR2 Q9HBW0 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10141469 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL10141464 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL12858360 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL2681108 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL10349281 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL2680512 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL17151524 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL10141466 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL10050676 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL12083081 1.00 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11829069-B2 Photoresist compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-11-28 US disclosed
US-11773266-B2 Polymer, molded body, foam, resin composition, and production method for polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-10-03 US disclosed
US-20230129965-A1 HYDROPHILIC AND OLEOPHOBIC POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-27 US disclosed
US-20180196178-A1 RESIN FILM, COLORING PHOTOSENSITIVE COMPOSITION, RESIN FILM PRODUCTION METHOD, COLOR FILTER, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2018-07-12 US disclosed
US-20180175299-A1 ORGANIC THIN FILM TRANSISTOR, METHOD OF MANUFACTURING ORGANIC THIN FILM TRANSISTOR, ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC SEMICONDUCTOR FILM, AND METHOD OF MANUFACTURING ORGANIC SEMICONDUCTOR FILM FUJIFILM CORPORATION (JP) 2018-06-21 US disclosed
US-9971241-B2 Compound, resin, resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-05-15 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
US-20170351179-A1 COMPOSITION FOR FORMING UPPER LAYER FILM, PATTERN FORMING METHOD USING THE SAME, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-12-07 US disclosed
US-20170329219-A1 PHOTORESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-11-16 US disclosed
US-9798235-B2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORPORATION (JP) 2017-10-24 US disclosed
US-20130177850-A1 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2013-07-11 US disclosed
US-8426109-B2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORPORATION (JP) 2013-04-23 US disclosed
US-20120288691-A1 PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-11-15 US disclosed
US-20120052444-A1 POLYMERIZABLE COMPOSITION, AND LITHOGRAPHIC PRINTING PLATE PRECURSOR, ANTIFOULING MEMBER AND ANTIFOGGING MEMBER EACH USING THE SAME FUJIFILM CORPORATION (JP) 2012-03-01 US disclosed
US-20120052442-A1 LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF FUJIFILM CORPORATION (JP) 2012-03-01 US disclosed
US-20120015293-A1 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-19 US disclosed
US-20110244270-A1 BINDER COMPOSITION FOR MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING MEDIUM FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-7863218-B2 Coating composition for producing heat-sensitive transfer image-receiving sheet and heat-sensitive transfer image-receiving sheet FUJIFILM CORPORATION (JP) 2011-01-04 US disclosed
US-20070202275-A1 Coating composition for producing heat-sensitive transfer image-receiving sheet and heat-sensitive transfer image-receiving sheet FUJIFILM CORPORATION (JP) 2007-08-30 US disclosed
US-20070081062-A1 Ink set and inkjet image recording method FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed