SCHEMBL1004962

SCHEMBL1004962

O=C1OC(=O)C2CC3CC2C=C13

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2135286 0.67
SCHEMBL15399673 0.66
SCHEMBL21917795 0.60 KDM4E (0.33)
SCHEMBL14669163 0.58
SCHEMBL13444708 0.58 KDM4E (0.39)
SCHEMBL24843176 0.58 KDM4E (0.39)
SCHEMBL14424191 0.58 KDM4E (0.39)
SCHEMBL16360071 0.58 KDM4E (0.39)
SCHEMBL15498544 0.58 KDM4E (0.39)
SCHEMBL615001 0.58 KDM4E (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1238797-B1 LAMINATED POLYESTER FILM TOYO BOSEKI (JP) 2013-07-31 EP claimed
EP-1923428-B1 POLYESTER RESIN AQUEOUS DISPERSION, COATING FILM OBTAINED FROM SAME, AND PACKAGING BAG USING SUCH COATING FILM UNITIKA LTD (JP) 2011-11-09 EP claimed
US-20100330489-A1 ELECTROSTATIC IMAGE DEVELOPING TONER, DEVELOPER, IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND PROCESS CARTRIDGE RICOH COMPANY, LTD. (JP) 2010-12-30 US claimed
EP-4692160-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION, ADHESIVE, AND ADHESIVE SHEET Mitsubishi Chemical Corporation (JP) 2026-02-11 EP disclosed
US-20260015527-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION, ADHESIVE, AND ADHESIVE SHEET MITSUBISHI CHEMICAL CORPORATION (JP) 2026-01-15 US disclosed
US-12391827-B2 Biaxially stretched polyamide film TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
EP-3862165-B1 BIAXIALLY ORIENTED POLYAMIDE FILM AND POLYAMIDE FILM MILL ROLL TOYO BOSEKI (JP) 2025-08-06 EP disclosed
WO-2025033172-A1 ADHESIVE COMPOSITION AND ADHESIVE SHEET 東洋紡株式会社 2025-02-13 WO disclosed
EP-4497797-A1 POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION, POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, DECORATIVE FILM, FILM FOR ELECTRONIC MEMBER, AND DECORATIVE MOLDED OBJECT Mitsubishi Chemical Corporation (JP) 2025-01-29 EP disclosed
US-20240417599-A1 POLYESTER PRESSURE-SENSITIVE ADHESIVE COMPOSITION, POLYESTER PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, DECORATIVE FILM, FILM FOR ELECTRONIC MEMBER, AND DECORATIVE MOLDED OBJECT MITSUBISHI CHEMICAL CORPORATION (JP) 2024-12-19 US disclosed
WO-2024204583-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION, ADHESIVE, AND ADHESIVE SHEET 三菱ケミカル株式会社 2024-10-03 WO disclosed
EP-0258419-A4 METHOD OF PRODUCING THERMOPLASTIC ELASTOMER COMPOSITIONS. TOA NENRYO KOGYO KK (US) 1988-07-29 EP disclosed
EP-0262180-A4 THERMOPLASTIC ELASTOMER COMPOSITION. TOA NENRYO KOGYO KK (US) 1988-07-29 EP disclosed
EP-0258429-A4 METHOD OF MANUFACTURE OF THERMOPLASTIC ELASTOMER COMPOSITIONS. TOA NENRYO KOGYO KK (US) 1988-07-14 EP disclosed
EP-0262180-A1 THERMOPLASTIC ELASTOMER COMPOSITION TOA NENRYO KOGYO K.K. (US) 1988-04-06 EP disclosed
EP-0258429-A1 METHOD OF MANUFACTURE OF THERMOPLASTIC ELASTOMER COMPOSITIONS TOA NENRYO KOGYO K.K. (US) 1988-03-09 EP disclosed
EP-0258419-A1 METHOD OF PRODUCING THERMOPLASTIC ELASTOMER COMPOSITIONS TOA NENRYO KOGYO K.K. (US) 1988-03-09 EP disclosed
WO-1987005310-A1 METHOD OF PRODUCING THERMOPLASTIC ELASTOMER COMPOSITIONS TOA NENRYO KOGYO K.K. (US) 1987-09-11 WO disclosed
WO-1987005309-A1 THERMOPLASTIC ELASTOMER COMPOSITION TOA NENRYO KOGYO K.K. (US) 1987-09-11 WO disclosed
WO-1987005308-A1 METHOD OF MANUFACTURE OF THERMOPLASTIC ELASTOMER COMPOSITIONS TOA NENRYO KOGYO K.K. (US) 1987-09-11 WO disclosed