⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propylene Oxide SCHEMBL19732812 | 0.98 | — | — | |
| SCHEMBL1006447 | 0.92 | — | — | |
| SCHEMBL4447476 | 0.90 | — | — | |
| Propylene Oxide SCHEMBL1717596 | 0.81 | CHRM2 (0.33) | — | |
| Propylene Oxide SCHEMBL1717411 | 0.81 | CHRM2 (0.33) | — | |
| Propylene Oxide SCHEMBL1004397 | 0.79 | TSHR (0.34) | — | |
| Propylene Oxide SCHEMBL2498638 | 0.74 | PDK1 (0.31) | — | |
| Propylene Oxide SCHEMBL1005323 | 0.74 | TSHR (0.31) | — | |
| SCHEMBL12881654 | 0.73 | TSHR (0.31) | — | |
| SCHEMBL9062176 | 0.71 | MEN1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024135958-A1 | LAMINATED FILM FOR SOLAR MODULE HAVING EXCELLENT RADIATION COOLING PROPERTIES, AND SOLAR MODULE COMPRISING SAME | 이근수 | 2024-06-27 | — | — | WO | disclosed |
| WO-2024128438-A1 | COATING FILM FOR SOLAR MODULE USING ORGANIC-INORGANIC HYBRID POLYMER COATING COMPOSITION | 이근수 | 2024-06-20 | — | — | WO | disclosed |
| CN-113045714-B | Low odor resin composition | 株式会社力森诺科 | 2023-09-15 | — | — | CN | disclosed |
| CN-109071777-B | Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product | 昭和电工株式会社 | 2022-06-10 | — | — | CN | disclosed |
| US-20210214471-A1 | RADICALLY POLYMERIZABLE PUTTY-LIKE RESIN COMPOSITION, SEALING AGENT AND CRACK REPAIRING METHOD | SHOWA DENKO K.K. (JP) | 2021-07-15 | — | — | US | disclosed |
| CN-113045714-A | Low odor resin composition | 昭和电工株式会社 | 2021-06-29 | — | — | CN | disclosed |
| CN-112789259-A | Method for repairing structure | 昭和电工株式会社 | 2021-05-11 | — | — | CN | disclosed |
| CN-112752775-A | Radical polymerizable resin composition and structural repair material | 昭和电工株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112236460-A | Radical polymerizable putty-like resin composition, sealant, and crack repairing method | 昭和电工株式会社 | 2021-01-15 | — | — | CN | disclosed |
| CN-106164080-B | Silicon compound, resin composition for coating agent, molded body, and image display device | 捷恩智株式会社 | 2020-11-10 | — | — | CN | disclosed |
| US-20160046052-A1 | TRANSFER FILM FOR IN-MOLD MOLDING, METHOD FOR PRODUCING IN-MOLD MOLDED BODY, AND MOLDED BODY | JNC CORPORATION (JP) | 2016-02-18 | — | — | US | disclosed |
| US-8840992-B2 | Curable resin composition and optical film | JNC CORPORATION (JP) | 2014-09-23 | — | — | US | disclosed |
| US-20140141223-A1 | WEATHER-RESISTANT MULTILAYER FILM | JNC CORPORATION (JP) | 2014-05-22 | — | — | US | disclosed |
| US-20140113115-A1 | TRANSFER FILM FOR IN-MOLD MOLDING AND METHOD FOR PRODUCING SAME | JNC CORPORATION (JP) | 2014-04-24 | — | — | US | disclosed |
| US-20130258482-A1 | LAMINATE BODY AND MANUFACTURING METHOD THEREOF | JNC CORPORATION (JP) | 2013-10-03 | — | — | US | disclosed |
| EP-2631068-A1 | LAMINATE BODY AND MANUFACTURING METHOD THEREOF | JNC Corporation (JP) | 2013-08-28 | — | — | EP | disclosed |
| US-20110189470-A1 | CURABLE RESIN COMPOSITION AND OPTICAL FILM | CHISSO CORPORATION (JP) | 2011-08-04 | — | — | US | disclosed |
| US-7868112-B2 | Fluorine-containing polymer and resin composition | CHISSO CORPORATION (JP) | 2011-01-11 | — | — | US | disclosed |
| US-20100063222-A1 | FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION | CHISSO CORPORATION (JP) | 2010-03-11 | — | — | US | disclosed |
| EP-2103636-A1 | FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION | Chisso Corporation (JP) | 2009-09-23 | — | — | EP | disclosed |