SCHEMBL10060673

SCHEMBL10060673

C=C(C)C(=O)OCCNC(=O)Nc1ccc(S)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CNR1 P21554 2/20 0.43
GAA P10253 2/20 0.42
NPSR1 Q6W5P4 1/20 0.42
RAB9A P51151 2/20 0.40
LMNA P02545 2/20 0.40
NPC1 O15118 1/20 0.40
HPGD P15428 1/20 0.40
MAPK1 P28482 1/20 0.40
NAMPT P43490 1/20 0.39
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
L3MBTL1 Q9Y468 2/20 0.39
ALDH1A1 P00352 2/20 0.39
MAPT P10636 1/20 0.39
PKM P14618 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
EPHX2 P34913 2/20 0.38
HDAC3 O15379 1/20 0.38
HDAC4 P56524 1/20 0.38
HDAC1 Q13547 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10093564 0.89 CNR1 (0.49) CNR1GAANPSR1RAB9ALMNA
SCHEMBL3246106 0.88 GAA (0.54) CNR1GAANPSR1RAB9ANPC1
SCHEMBL1735929 0.88 CNR1 (0.44) CNR1GAANPSR1RAB9ALMNA
SCHEMBL23848315 0.86 MTNR1B (0.45) CNR1GAANPSR1RAB9ALMNA
SCHEMBL31151992 0.86 CNR1 (0.43) CNR1GAANPSR1RAB9ALMNA
SCHEMBL3252273 0.86 NPSR1 (0.55) GAANPSR1RAB9ALMNANPC1
SCHEMBL19092271 0.85 SMN1; SMN2 (0.54) CNR1GAARAB9ANPC1NAMPT
SCHEMBL3253715 0.85 POLB (0.53) CNR1GAANPSR1RAB9ANPC1
SCHEMBL12354546 0.84 HDAC3 (0.53) CNR1GAANPSR1RAB9ANPC1
SCHEMBL25492448 0.84 TRPV1 (0.46) CNR1GAANPSR1RAB9ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 EP disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-20090220753-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-09-03 US disclosed
EP-2085220-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM Corporation (JP) 2009-08-05 EP disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed