SCHEMBL10064407

SCHEMBL10064407

CCC(C)(C)C(=O)OC1CC2OC1C1C(=O)OCC21

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.34
HMGCR P04035 3/20 0.34
USP2 O75604 2/20 0.34
ALDH1A1 P00352 2/20 0.34
TSHR P16473 2/20 0.34
SLCO1B1 Q9Y6L6 2/20 0.34
KDM4E B2RXH2 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
NR1I2 O75469 1/20 0.34
ABCB11 O95342 1/20 0.34
NR3C1 P04150 1/20 0.34
PGR P06401 1/20 0.34
ABCB1 P08183 1/20 0.34
ADORA3 P0DMS8 1/20 0.34
CYP2C8 P10632 1/20 0.34
CHRM1 P11229 1/20 0.34
ADRB3 P13945 1/20 0.34
GABRA1 P14867 1/20 0.34
ADRA2B P18089 1/20 0.34
ADRA2C P18825 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10015628 0.91 CYP3A4 (0.34) CYP3A4HMGCRUSP2ALDH1A1TSHR
SCHEMBL16744068 0.89
SCHEMBL8798340 0.85
SCHEMBL12866044 0.83 CHRM2 (0.35) CHRM1PPP5C
SCHEMBL15726650 0.81 PPM1B (0.40) CYP3A4HMGCRUSP2ALDH1A1TSHR
SCHEMBL24401047 0.81 LMNA (0.34) CYP3A4TSHRCHRM1PPP5C
SCHEMBL12196930 0.81 PPP5C (0.34) PPP5C
SCHEMBL13019005 0.79
SCHEMBL13563611 0.79 PPP5C (0.32) CYP3A4HMGCRUSP2ALDH1A1TSHR
SCHEMBL47531 0.78 HMGCR (0.35) CYP3A4HMGCRUSP2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240241441-A1 POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-07-18 US disclosed
US-20240241440-A1 POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-07-18 US disclosed
US-20230137472-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 US disclosed
US-9316909-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-19 US disclosed
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed
US-20150147696-A1 METHOD FOR PRODUCING POLYMER COMPOUND, POLYMER COMPOUND, AND PHOTORESIST RESIN COMPOSITION DAICEL CORPORATION (JP) 2015-05-28 US disclosed
US-20120009529-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-01-12 US disclosed