SCHEMBL10065210

SCHEMBL10065210

N#Cc1ccc(-c2ccc(N=C=O)cc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP3 P08254 2/20 0.48
CYP3A4 P08684 2/20 0.47
TSHR P16473 1/20 0.47
CA12 O43570 2/20 0.46
CA2 P00918 2/20 0.46
CA9 Q16790 2/20 0.46
CA1 P00915 1/20 0.46
KIF11 P52732 3/20 0.44
NOS3 P29474 2/20 0.42
NOS1 P29475 2/20 0.42
CYP11B2 P19099 1/20 0.40
CYP1B1 Q16678 1/20 0.40
PTPN5 P54829 1/20 0.40
MAPK1 P28482 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
MMP2 P08253 2/20 0.39
HDAC2 Q92769 1/20 0.39
MMP12 P39900 1/20 0.38
MMP13 P45452 1/20 0.38
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL135741 0.94 CYP3A4 (0.52) MMP3CYP3A4TSHRCA12CA2
SCHEMBL22798869 0.88 CYP3A4 (0.47) MMP3CYP3A4TSHRCA12CA2
Water SCHEMBL3898007 0.87 CYP3A4 (0.58) CYP3A4TSHRCA2CA1MAPK1
SCHEMBL23721668 0.84 CYP3A4 (0.61) CYP3A4TSHRCA2CA1MAPK1
SCHEMBL241534 0.84 CYP3A4 (0.61) CYP3A4TSHRCA2CA1MAPK1
SCHEMBL10299686 0.82 PARP15 (0.50) CYP3A4TSHRCA12CA2CA9
SCHEMBL13907414 0.82 TSHR (0.57) CYP3A4TSHRCA12CA2CA9
SCHEMBL13170270 0.82 PARP15 (0.50) CYP3A4TSHRCA12CA2CA9
SCHEMBL1107101 0.82 CYP3A4 (0.74) CYP3A4TSHRNOS3NOS1CYP11B2
SCHEMBL13081964 0.82 CYP19A1 (0.49) CYP3A4TSHRCA12CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173220-B2 Method of producing metal plated material FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20110183078-A1 METHOD OF PRODUCING METAL PLATED MATERIAL FUJIFILM CORPORATION (JP) 2011-07-28 US disclosed
US-20110088934-A1 METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME FUJIFILM CORPORATION (JP) 2011-04-21 US disclosed
US-20100323174-A1 METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS FUJIFILM CORPORATION (JP) 2010-12-23 US disclosed