Tetrahydrofuran

Tetrahydrofuran

SCHEMBL1006595

C1CCOC1.OCC(CO)(CO)COCC(CO)(CO)CO

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxirane SCHEMBL1006448 0.87 ALDH1A1 (0.30) ALDH1A1
Tetrahydrofuran SCHEMBL9062179 0.82 ALDH1A1 (0.50) ALDH1A1
SCHEMBL15930 0.79 ALDH1A1 (0.39) ALDH1A1
SCHEMBL3096124 0.79 ALDH1A1 (0.39) ALDH1A1
SCHEMBL24056316 0.76 ALDH1A1 (0.37) ALDH1A1
SCHEMBL1321753 0.76 ALDH1A1 (0.37) ALDH1A1
Water SCHEMBL6513600 0.76 ALDH1A1 (0.37) ALDH1A1
SCHEMBL157659 0.76 ALDH1A1 (0.37) ALDH1A1
SCHEMBL14022846 0.76 ALDH1A1 (0.37) ALDH1A1
SCHEMBL8663211 0.76 ALDH1A1 (0.37) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104558544-B Multifunctional acid anhydrides, thermosetting resin composition and its prepreg and hardening thing 日本化药株式会社 2018-06-29 CN claimed
CN-104558544-A Polyfunctional acid anhydride, a thermosetting resin composition and its cured prepreg NIPPONKAYAKU KABUSHIKI KAISHA 2015-04-29 CN claimed
WO-2024135958-A1 LAMINATED FILM FOR SOLAR MODULE HAVING EXCELLENT RADIATION COOLING PROPERTIES, AND SOLAR MODULE COMPRISING SAME 이근수 2024-06-27 WO disclosed
WO-2024128438-A1 COATING FILM FOR SOLAR MODULE USING ORGANIC-INORGANIC HYBRID POLYMER COATING COMPOSITION 이근수 2024-06-20 WO disclosed
CN-112236460-B Free radical polymerizable putty-like resin composition, sealant, and crack repair method 株式会社力森诺科 2023-09-22 CN disclosed
CN-113045714-B Low odor resin composition 株式会社力森诺科 2023-09-15 CN disclosed
CN-109071777-B Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product 昭和电工株式会社 2022-06-10 CN disclosed
US-20220049039-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL SHOWA DENKO K.K. (JP) 2022-02-17 US disclosed
US-20210283655-A1 STRUCTURE REPAIRING METHOD SHOWA DENKO K.K. (JP) 2021-09-16 US disclosed
EP-3858880-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL Showa Denko K.K. (JP) 2021-08-04 EP disclosed
EP-3858805-A1 STRUCTURE REPAIRING METHOD Showa Denko K.K. (JP) 2021-08-04 EP disclosed
US-20130258482-A1 LAMINATE BODY AND MANUFACTURING METHOD THEREOF JNC CORPORATION (JP) 2013-10-03 US disclosed
EP-2631068-A1 LAMINATE BODY AND MANUFACTURING METHOD THEREOF JNC Corporation (JP) 2013-08-28 EP disclosed
CN-103153617-A Laminate body and manufacturing method thereof JNC CORP 2013-06-12 CN disclosed
US-20110189470-A1 CURABLE RESIN COMPOSITION AND OPTICAL FILM CHISSO CORPORATION (JP) 2011-08-04 US disclosed
US-7868112-B2 Fluorine-containing polymer and resin composition CHISSO CORPORATION (JP) 2011-01-11 US disclosed
US-20100063222-A1 FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION CHISSO CORPORATION (JP) 2010-03-11 US disclosed
EP-2103636-A1 FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION Chisso Corporation (JP) 2009-09-23 EP disclosed
CN-1098894-C Solidified resin composition and preparation method thereof NIPPON CATALYTIC CHEM IND (JP) 2003-01-15 CN disclosed
CN-1221007-A Solidified resin composition and preparation method thereof NIPPON CATALYTIC CHEM IND (JP) 1999-06-30 CN disclosed