SCHEMBL10085451

SCHEMBL10085451

CSc1ccc(C(=O)C(C)(C)OS(=O)(=O)c2ccc(C)cc2)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.44
MAPT P10636 3/20 0.44
MEN1 O00255 3/20 0.44
KMT2A Q03164 3/20 0.44
ALOX12 P18054 1/20 0.44
TSHR P16473 5/20 0.42
SMN1; SMN2 Q16637 3/20 0.42
GAA P10253 1/20 0.42
ALOX15 P16050 1/20 0.42
HTT P42858 1/20 0.42
LMNA P02545 2/20 0.41
NPSR1 Q6W5P4 1/20 0.41
MAPK1 P28482 1/20 0.41
PPARG P37231 1/20 0.39
PPARD Q03181 1/20 0.39
PPARA Q07869 1/20 0.39
AKR1C3 P42330 1/20 0.39
DNMT1 P26358 1/20 0.38
STAT3 P40763 1/20 0.38
PLK1 P53350 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6230138 0.82 RECQL (0.49) ALDH1A1MAPTMEN1KMT2ASMN1; SMN2
SCHEMBL5272382 0.80 ALDH1A1 (0.47) ALDH1A1MAPTMEN1KMT2AALOX12
SCHEMBL13205306 0.76 STAT3 (0.40) ALDH1A1MAPTMEN1KMT2AALOX12
SCHEMBL1990108 0.76 MEN1 (0.43) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL10777025 0.75 STAT3 (0.52) ALDH1A1MAPTMEN1KMT2AALOX12
SCHEMBL3095908 0.75 ALDH1A1 (0.44) ALDH1A1MAPTMEN1KMT2AALOX12
SCHEMBL6491558 0.74 ALDH1A1 (0.46) ALDH1A1MAPTMEN1KMT2AGAA
SCHEMBL10009828 0.73 TP53 (0.48) ALDH1A1MAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7619447 0.73 ALDH1A1 (0.50) ALDH1A1MAPTMEN1KMT2ATSHR
SCHEMBL10226698 0.72 CES1 (0.43) ALDH1A1TSHRPPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8481244-B2 Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-07-09 US disclosed
US-8481244-B2 Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-07-09 US disclosed
EP-2305754-B1 Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film SHINETSU CHEMICAL CO (JP) 2012-01-25 EP disclosed
EP-2305754-A1 Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film Shin-Etsu Chemical Co., Ltd. (JP) 2011-04-06 EP disclosed
US-20110076465-A1 EPOXY-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-03-31 US disclosed
US-20110076465-A1 EPOXY-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-03-31 US disclosed