Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | FKBP1A | P62942 | 2/20 | 0.33 |
| ▸ | GLA | P06280 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14682255 | 0.95 | CA1 (0.37) | CA1CA2POLBKMT2AFKBP1A | |
| SCHEMBL13464444 | 0.89 | CA1 (0.35) | CA1CA2POLBKMT2AFKBP1A | |
| SCHEMBL178329 | 0.87 | KDM4E (0.38) | KMT2A | |
| SCHEMBL8736879 | 0.85 | KDM4E (0.36) | KMT2A | |
| SCHEMBL2754970 | 0.85 | KDM4E (0.37) | — | |
| SCHEMBL106612 | 0.85 | — | — | |
| SCHEMBL12386322 | 0.85 | CA1 (0.32) | CA1CA2POLBKMT2ATSHR | |
| SCHEMBL12465140 | 0.83 | MEN1 (0.36) | POLBKMT2A | |
| SCHEMBL11923714 | 0.82 | CA1 (0.35) | CA1CA2POLBKMT2AFKBP1A | |
| SCHEMBL14924179 | 0.82 | CA1 (0.30) | CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230213861-A1 | METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-07-06 | — | — | US | disclosed |
| US-20230148344-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND METHOD FOR PRODUCING COMPOUND | FUJIFILM CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| US-20230148344-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND METHOD FOR PRODUCING COMPOUND | FUJIFILM CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| US-11181820-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2021-11-23 | — | — | US | disclosed |
| US-11009791-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2021-05-18 | — | — | US | disclosed |
| US-10761426-B2 | Pattern forming method, method for manufacturing electronic device, and laminate | FUJIFILM CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-20190329292-A1 | SURFACE TREATMENT LIQUID AND SURFACE TREATMENT METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-10-31 | — | — | US | disclosed |
| US-10400078-B2 | Surface treatment liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-09-03 | — | — | US | disclosed |
| US-20190137875-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2019-05-09 | — | — | US | disclosed |
| US-20180217497-A1 | PATTERN FORMING METHOD AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION | FUJIFILM CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |
| US-20100112477-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-20100112477-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-7666574-B2 | Positive resist composition and pattern forming method | FUJIFILM CORPORATION (JP) | 2010-02-23 | — | — | US | disclosed |
| US-7666574-B2 | Positive resist composition and pattern forming method | FUJIFILM CORPORATION (JP) | 2010-02-23 | — | — | US | disclosed |
| US-7635554-B2 | Positive resist composition and pattern forming method | FUJIFILM CORPORATION (JP) | 2009-12-22 | — | — | US | disclosed |
| US-7635554-B2 | Positive resist composition and pattern forming method | FUJIFILM CORPORATION (JP) | 2009-12-22 | — | — | US | disclosed |
| US-20080248421-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-20080248421-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-20080241746-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-10-02 | — | — | US | disclosed |
| US-20080241746-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-10-02 | — | — | US | disclosed |