Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA9 | Q16790 | 5/20 | 0.60 |
| ▸ | CA1 | P00915 | 4/20 | 0.60 |
| ▸ | CA12 | O43570 | 3/20 | 0.60 |
| ▸ | HTT | P42858 | 2/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.54 |
| ▸ | POLB | P06746 | 1/20 | 0.54 |
| ▸ | HPGD | P15428 | 1/20 | 0.54 |
| ▸ | RAB9A | P51151 | 2/20 | 0.51 |
| ▸ | NPC1 | O15118 | 1/20 | 0.51 |
| ▸ | TSHR | P16473 | 1/20 | 0.51 |
| ▸ | CASP1 | P29466 | 1/20 | 0.51 |
| ▸ | CASP7 | P55210 | 1/20 | 0.51 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.51 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.51 |
| ▸ | CA2 | P00918 | 4/20 | 0.51 |
| ▸ | MEN1 | O00255 | 3/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.50 |
| ▸ | CA4 | P22748 | 3/20 | 0.50 |
| ▸ | CA7 | P43166 | 2/20 | 0.49 |
| ▸ | GFER | P55789 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13155491 | 0.96 | CA9 (0.65) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL1696020 | 0.90 | CA9 (0.58) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL4570499 | 0.88 | MMP13 (0.61) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL15397059 | 0.86 | NPSR1 (0.57) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL15695620 | 0.85 | CA9 (0.47) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL10098943 | 0.85 | CA12 (0.64) | CA9CA1CA12ALDH1A1RAB9A | |
| SCHEMBL12405524 | 0.84 | CA9 (0.52) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL12405518 | 0.84 | NPSR1 (0.73) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL15503319 | 0.83 | MEN1 (0.61) | CA9CA1CA12HTTALDH1A1 | |
| SCHEMBL12405517 | 0.83 | MAPK1 (0.62) | CA9CA1CA12HTTALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9201176-B2 | Light-shielding film | TOYOBO CO., LTD. (JP) | 2015-12-01 | — | — | US | disclosed |
| US-20130309489-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD | DIC CORPORATION (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8470913-B2 | Thermosetting resin composition and cured product of the same | DIC CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| US-20130065039-A1 | LIGHT-SHIELDING FILM | TOYOBO CO., LTD. (JP) | 2013-03-14 | — | — | US | disclosed |
| US-8222365-B2 | Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2012-07-17 | — | — | US | disclosed |
| US-20120142829-A1 | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME | DIC CORPORATION (JP) | 2012-06-07 | — | — | US | disclosed |
| US-7728102-B2 | Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-06-01 | — | — | US | disclosed |
| US-20100018756-A1 | POLYAMIDEIMIDE RESIN, AS WELL AS A COLORLESS AND TRANSPARENT FLEXIBLE METAL-CLAD LAMINATE AND CIRCUIT BOARD OBTAINED THEREFROM | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-01-28 | — | — | US | disclosed |
| US-20080174016-A1 | Flexible Printed Wiring Board and Semiconductor Device | MITSUI MINING & SMELTING CO., LTD. (JP) | 2008-07-24 | — | — | US | disclosed |
| US-7364799-B2 | Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2008-04-29 | — | — | US | disclosed |