⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Guanidine SCHEMBL981791 | 0.87 | — | — | |
| Guanidine SCHEMBL981793 | 0.87 | — | — | |
| SCHEMBL47243 | 0.87 | — | — | |
| SCHEMBL17775923 | 0.87 | — | — | |
| Water SCHEMBL45389 | 0.85 | — | — | |
| Water SCHEMBL4375399 | 0.85 | — | — | |
| Pimagedine SCHEMBL980396 | 0.80 | — | — | |
| SCHEMBL12333924 | 0.78 | — | — | |
| SCHEMBL1172811 | 0.78 | — | — | |
| SCHEMBL8573556 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7090895-B2 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | claimed |
| US-20040152804-A1 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-05 | — | — | US | claimed |
| CN-114316839-A | Anisotropic conductive connecting material and method for mounting electronic component using anisotropic conductive connecting material | 太阳油墨制造株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-9567222-B2 | Blending improvement carbon-composite having carbon-nanotube and its continuous manufacturing method and apparatus | HANWHA CHEMICAL CORPORATION (KR) | 2017-02-14 | — | — | US | disclosed |
| US-9196393-B2 | Foamed resin molded product, foamed insulated wire, cable and method of manufacturing foamed resin molded product | HITACHI METALS, LTD. (JP) | 2015-11-24 | — | — | US | disclosed |
| US-8901184-B2 | Foamed resin molded article, foam insulated wire, cable and method of manufacturing foamed resin molded article | HITACHI METALS, LTD. (JP) | 2014-12-02 | — | — | US | disclosed |
| US-20140080933-A1 | FOAMED RESIN MOLDED ARTICLE, FOAM INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED ARTICLE | HITACHI CABLE, LTD. (JP) | 2014-03-20 | — | — | US | disclosed |
| US-20140069686-A1 | FOAMED RESIN MOLDED PRODUCT, FOAMED INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED PRODUCT | HITACHI CABLE, LTD. (JP) | 2014-03-13 | — | — | US | disclosed |
| US-20120112134-A1 | Blending Improvement Carbon-Composite having Carbon-Nanotube and its Continuous Manufacturing Method and Apparatus | HANWHA CHEMICAL CORPORATION (KR) | 2012-05-10 | — | — | US | disclosed |
| EP-2448862-A2 | BLENDING IMPROVEMENT CARBON-COMPOSITE HAVING CARBON-NANOTUBE AND ITS CONTINUOUS MANUFACTURING METHOD AND APPARATUS | Hanwha Chemical Corporation (KR) | 2012-05-09 | — | — | EP | disclosed |
| WO-2011002222-A2 | BLENDING IMPROVEMENT CARBON-COMPOSITE HAVING CARBON-NANOTUBE AND ITS CONTINUOUS MANUFACTURING METHOD AND APPARATUS | HANWHA CHEMICAL CORPORATION (KR) | 2011-01-06 | — | — | WO | disclosed |
| US-7090895-B2 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | disclosed |
| US-6790887-B1 | SHAPED ARTICLES HAVING EXCELLENT MECHANICAL PROPERTIES, EXCELLENT LIGHT STABILITY AND EXCELLENT APPEARANCE FROM AROMATIC POLYCARBONATE MIXED WITH SILICONE CONTAINING FIRE RETARDANT | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-09-14 | — | — | US | disclosed |
| US-20040152804-A1 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-05 | — | — | US | disclosed |