Known targets — ChEMBL curated mechanism
KCNA1KCNA10KCNA2KCNA3KCNA4KCNA5KCNA6KCNA7KCNB1KCNB2KCNC1KCNC2KCNC3KCNC4KCND1KCND2KCND3KCNF1KCNG1KCNG2KCNG3KCNG4KCNH1KCNH2KCNH3KCNH4KCNH5KCNH6KCNH7KCNH8KCNQ1KCNQ2KCNQ3KCNQ4KCNQ5KCNS1KCNS2KCNS3KCNV1KCNV2
The experimentally established mechanism targets of Guanidine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Guanidine SCHEMBL981791 | 1.00 | — | — | |
| Pimagedine SCHEMBL980396 | 0.87 | — | — | |
| SCHEMBL1010881 | 0.87 | — | — | |
| SCHEMBL12333924 | 0.84 | — | — | |
| SCHEMBL1172811 | 0.84 | — | — | |
| SCHEMBL17775923 | 0.82 | — | — | |
| SCHEMBL47243 | 0.82 | — | — | |
| SCHEMBL8573556 | 0.82 | — | — | |
| Water SCHEMBL45389 | 0.81 | — | — | |
| SCHEMBL2878602 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7090895-B2 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | claimed |
| US-20040152804-A1 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-05 | — | — | US | claimed |
| CN-114316839-A | Anisotropic conductive connecting material and method for mounting electronic component using anisotropic conductive connecting material | 太阳油墨制造株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-9567222-B2 | Blending improvement carbon-composite having carbon-nanotube and its continuous manufacturing method and apparatus | HANWHA CHEMICAL CORPORATION (KR) | 2017-02-14 | — | — | US | disclosed |
| US-9196393-B2 | Foamed resin molded product, foamed insulated wire, cable and method of manufacturing foamed resin molded product | HITACHI METALS, LTD. (JP) | 2015-11-24 | — | — | US | disclosed |
| US-8901184-B2 | Foamed resin molded article, foam insulated wire, cable and method of manufacturing foamed resin molded article | HITACHI METALS, LTD. (JP) | 2014-12-02 | — | — | US | disclosed |
| US-20140080933-A1 | FOAMED RESIN MOLDED ARTICLE, FOAM INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED ARTICLE | HITACHI CABLE, LTD. (JP) | 2014-03-20 | — | — | US | disclosed |
| US-20140069686-A1 | FOAMED RESIN MOLDED PRODUCT, FOAMED INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED PRODUCT | HITACHI CABLE, LTD. (JP) | 2014-03-13 | — | — | US | disclosed |
| US-20120112134-A1 | Blending Improvement Carbon-Composite having Carbon-Nanotube and its Continuous Manufacturing Method and Apparatus | HANWHA CHEMICAL CORPORATION (KR) | 2012-05-10 | — | — | US | disclosed |
| US-7867416-B2 | Thermoplastic elastomer composition for core-back system foam injection molding and foam injection molding method using the same | HONDA MOTOR CO., LTD. (JP) | 2011-01-11 | — | — | US | disclosed |
| US-20090108485-A1 | THERMOPLASTIC ELASTOMER COMPOSITION FOR CORE-BACK SYSTEM FOAM INJECTION MOLDING AND FOAM INJECTION MOLDING METHOD USING THE SAME | HONDA MOTOR CO., LTD. (JP) | 2009-04-30 | — | — | US | disclosed |
| US-7090895-B2 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | disclosed |
| EP-0726290-B2 | A polyolefin based crosslinked foam | TORAY INDUSTRIES (JP) | 2005-10-19 | — | — | EP | disclosed |
| US-20050029692-A1 | Thermoplastic elastomer composition for core back type injection foaming and injection foaming method using the same | HONDA MOTOR CO., LTD. (JP) | 2005-02-10 | — | — | US | disclosed |
| US-20040152804-A1 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-05 | — | — | US | disclosed |
| EP-0726290-B1 | A polyolefin based crosslinked foam | TORAY INDUSTRIES (JP) | 2002-05-08 | — | — | EP | disclosed |
| US-5786406-A | ALSO INCLUDING CONJUGATED DIENE POLYMER; IMPACT AND VIBRATION ABSORBABLE | TORAY INDUSTRIES, INC. (JP) | 1998-07-28 | — | — | US | disclosed |
| EP-0726290-A1 | A polyolefin based crosslinked foam | TORAY INDUSTRIES, INC. (JP) | 1996-08-14 | — | — | EP | disclosed |