SCHEMBL101126

SCHEMBL101126

Nc1ccc(C2(c3ccc(N)c(Cl)c3)c3ccccc3-c3ccccc32)cc1Cl

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.56
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
KDM4E B2RXH2 1/20 0.56
LMNA P02545 1/20 0.56
OPRK1 P41145 1/20 0.56
SMN1; SMN2 Q16637 1/20 0.56
ESR2 Q92731 2/20 0.47
ESR1 P03372 1/20 0.47
TSHR P16473 4/20 0.41
CYP3A4 P08684 4/20 0.41
ALDH1A1 P00352 3/20 0.39
MAPK1 P28482 1/20 0.39
ADORA2A P29274 1/20 0.36
CA12 O43570 2/20 0.35
CA1 P00915 2/20 0.35
CA2 P00918 2/20 0.35
CA4 P22748 2/20 0.35
CA6 P23280 2/20 0.35
CA5A P35218 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29579848 1.00 MAPT (0.56) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL29503457 1.00 MAPT (0.56) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL24242241 0.91 ESR2 (0.51) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL20340482 0.91 ESR1 (0.51) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL7050050 0.91 ESR1 (0.55) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL29580239 0.91 ESR1 (0.55) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL27212622 0.91 ESR1 (0.55) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL8984632 0.84 MAPT (0.42) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL30952102 0.83 MEN1 (0.62) MAPTMEN1KMT2AKDM4ELMNA
SCHEMBL6138389 0.83 MEN1 (0.62) MAPTMEN1KMT2AKDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 284 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025022050-A1 DEVICE FOR HEATING A RESIN FOR AN APPARATUS FOR MANUFACTURING A COMPOSITE PART SAFRAN (FR) 2025-01-30 WO claimed
US-20240218170-A1 POLYIMIDE RESIN COMPOSITION, POLYIMIDE-BASED ADHESIVE COMPOSITION, POLYIMIDE ADHESIVE FILM, AND FLEXIBLE METAL CLAD LAMINATE FILM NEXFLEX CO., LTD. (KR) 2024-07-04 US claimed
US-12024594-B2 Multifunctional materials for temporary bonding BREWER SCIENCE, INC. (US) 2024-07-02 US claimed
EP-3728390-B1 CURABLE EPOXY SYSTEM HUNTSMAN ADVANCED MAT AMERICAS LLC (US) 2023-03-01 EP claimed
US-11548978-B2 Curable epoxy system HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2023-01-10 US claimed
EP-4051723-A1 EPOXY RESIN COMPOSITIONS Hexcel Composites Limited (GB) 2022-09-07 EP claimed
US-20210403637-A1 CURABLE RESIN COMPOSITION AND FIBER REINFORCED RESIN MATRIX COMPOSITE MATERIAL CYTEC INDUSTRIES INC. 2021-12-30 US claimed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US claimed
WO-2021222194-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. (US) 2021-11-04 WO claimed
US-20210332188-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. 2021-10-28 US claimed
US-6577492-B2 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer 3M INNOVATIVE PROPERTIES COMPANY 2003-06-10 US claimed
EP-1303882-A1 TRANSISTOR GATE INSULATOR LAYER INCORPORATING SUPERFINE CERAMIC PARTICLES 3M Innovative Properties Company (US) 2003-04-23 EP claimed
EP-0851887-B1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING & MFG (US) 2003-04-23 EP claimed
US-20030030966-A1 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes 3M INNOVATIVE PROPERTIES COMPANY 2003-02-13 US claimed
WO-2002009190-A1 TRANSISTOR GATE INSULATOR LAYER INCORPORATING SUPERFINE CERAMIC PARTICLES 3M INNOVATIVE PROPERTIES COMPANY (US) 2002-01-31 WO claimed
US-6054221-A A FLUORENE AMINE CURATIVE PARTIALLY MELT DISSOLVED AND PARTIALLY DISPERSED AS A SOLID IN AN AROMATIC POLYEPOXIDE; PREPREGS HAVING TACK WITH GOOD SHELF LIFE PROPERTIES; NON-DIFFUSING; COMPARABLE GLASS TRANSITION TEMPERATURES 3M INNOVATIVE PROPERTIES COMPANY (US) 2000-04-25 US claimed
US-5728755-A EXHIBIT TACK AND GOOD SHELF LIFE, LITTLE RESIN MIGRATION AND GLASS TRANSITION TEMPERATURE SIMILAR TO THOSE CURED NEAT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-03-17 US claimed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP claimed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US claimed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20210403637-A1 CURABLE RESIN COMPOSITION AND FIBER REINFORCED RESIN MATRIX COMPOSITE MATERIAL RCC1, MED25, CAND1 MAPT 125/4885MEN1 3295/4885KMT2A 1442/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.