SCHEMBL10139381

SCHEMBL10139381

C=C(C)C(=O)OCCOC(=O)CC(=O)C(F)(F)F

nearest known ligand 0.53

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.53
TSHR P16473 3/20 0.43
ALDH1A1 P00352 2/20 0.38
POLB P06746 1/20 0.37
APEX1 P27695 1/20 0.37
HTT P42858 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
MGAM O43451 1/20 0.33
GAA P10253 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
CES2 O00748 1/20 0.32
PLOD2 O00469 1/20 0.31
PLOD3 O60568 1/20 0.31
PLOD1 Q02809 1/20 0.31
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7758566 0.85 THRB (0.63) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL62134 0.80 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL21880923 0.80 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL15263096 0.80 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL7782426 0.80 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL13979456 0.79 THRB (0.61) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL13557175 0.79 THRB (0.52) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL12394966 0.79 THRB (0.61) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL2625700 0.79 THRB (0.52) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL12394964 0.79 THRB (0.61) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221644-A1 METHOD FOR PRODUCING COMPOSITION FOR FORMING NON-PHOTOSENSITIVE UPPER LAYER FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 US disclosed
US-20230221644-A1 METHOD FOR PRODUCING COMPOSITION FOR FORMING NON-PHOTOSENSITIVE UPPER LAYER FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 US disclosed
US-9926462-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2018-03-27 US disclosed
US-9926462-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2018-03-27 US disclosed
US-9926462-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2018-03-27 US disclosed
US-20170073541-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2017-03-16 US disclosed
US-20170073541-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2017-03-16 US disclosed
US-20170073541-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2017-03-16 US disclosed
US-9540535-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2017-01-10 US disclosed
US-9540535-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2017-01-10 US disclosed
US-9540535-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2017-01-10 US disclosed
US-20130217850-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2013-08-22 US disclosed
US-20130217850-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2013-08-22 US disclosed
US-20130217850-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2013-08-22 US disclosed
US-20120034560-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND POLYMER JSR CORPORATION (JP) 2012-02-09 US disclosed
US-20120034560-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND POLYMER JSR CORPORATION (JP) 2012-02-09 US disclosed
US-7507525-B2 Polymerizable composition and lithographic printing plate precursor FUJIFILM CORPORATION (JP) 2009-03-24 US disclosed
US-7279539-B2 Alkali-soluble polymer and polymerizable composition thereof FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 US disclosed